Transfer molded fluid flow structure

Patent metadata

Field	Value
Publication number	US-2016009085-A1
Application number	US-201314770402-A
Country	US
Kind code	A1
Filing date	Jul 29, 2013
Priority date	Feb 28, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.

First claim

What is claimed is:

1 . A fluid flow structure, comprising:
a micro device embedded in a molding; a fluid feed hole formed through the micro device; and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.

2 . A structure as in claim 1 , wherein the channel has a shape with contours that inversely follow a topography of a mold chase used to form the channel.

3 . A structure as in claim 1 , wherein the channel comprises first and second sidewalls that diverge from one another as they extend away from the micro device and converge toward one another as they near the micro device.

4 . A structure as in claim 1 , wherein the channel comprises first and second straight side walls that are substantially parallel to one another.

5 . A structure as in claim 1 , wherein the channel comprises first and second straight side walls that are tapered with respect to one another.

6 . A structure as in claim 1 , wherein the channel comprises first and second curved side walls that mirror one another.

7 . A structure as in claim 1 , wherein the channel comprises first and second side walls, each side wall having multiple contours selected from the group consisting of a straight contour, a tapered contour, and a curved contour.

8 . A structure as in claim 7 , wherein the multiple contours of the first side wall mirror the multiple contours of the second side wall.

9 . A fluid flow structure comprising:
a monolithic body transfer molded around multiple printhead sliver substrates; and multiple transfer molded fluid channels in the body through which fluid can flow directly to one or more of the substrates.

10 . A structure as in claim 9 , wherein the channels have different shapes.

11 . A structure as in claim 9 , wherein a single channel fluidically couples multiple substrates such that fluid can flow directly to the multiple substrates through the single channel.

12 . A method of making a fluid channel in a fluid flow structure, comprising:
attaching a printhead die to a carrier, forming a die carrier assembly; positioning the die carrier assembly onto a bottom mold chase; positioning a top mold chase over the die carrier assembly, creating a cavity between the top and bottom mold chases; filling the cavity with epoxy mold compound.

13 . A method as in claim 12 , wherein positioning a top mold chase over the die carrier assembly comprises sealing ink feed holes at a backside exterior surface of the printhead die.

14 . A method as in claim 12 , wherein filling the cavity with epoxy mold compound comprises:
forming a molded body that encapsulates the printhead die; and forming a molded fluid channel within the molded body through which fluid can flow directly to the printhead die.

15 . A method as in claim 12 , wherein filing the cavity with epoxy mold compound comprises:
preheating the epoxy mold compound to a liquid phase; creating a vacuum within the cavity; and injecting the liquid epoxy mold compound into the cavity.

16 . A method as in claim 14 , further comprising:
cooling the epoxy mold compound; removing the die carrier assembly with the molded body from the top and bottom mold chase; and releasing the molded body from the carrier.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Cumbie Michael W

Classifications

• B41J2002/14491

  Electrical connection · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2/1628

  dry etching · CPC title

• B41J2/14016

  Structure of bubble jet print heads · CPC title

• B41J2/162

  Manufacturing of the nozzle plates · CPC title