Apparatus for cleaning substrate and substrate cleaning method

Patent metadata

Field	Value
Publication number	US-11094548-B2
Application number	US-201716313442-A
Country	US
Kind code	B2
Filing date	Jun 26, 2017
Priority date	Jun 27, 2016
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

First claim

The invention claimed is:

1. An apparatus for cleaning a substrate comprising:
a holding unit that holds the substrate;
a rotated unit connected to the holding unit;
a rotating unit that is provided on a peripheral outer side of the rotated unit and rotates the rotated unit;
a cleaning unit that physically cleans the substrate held by the holding unit; and
a rotation cup connected to the rotated unit, wherein
the rotated unit is provided at a lower end of the rotation cup, and
the holding unit is provided at an upper end of the rotated unit.

2. The apparatus for cleaning the substrate according to claim 1 , wherein
the rotating unit rotates the rotated unit in a non-contacting state with the rotated unit.

3. The apparatus for cleaning the substrate according to claim 1 , wherein
the cleaning unit has a first cleaning unit that physically cleans a first surface of the substrate and a second cleaning unit that physically cleans a second surface on an opposite side of the first surface.

4. The apparatus for cleaning the substrate according to claim 1 , wherein
the cleaning unit physically cleans the substrate with 0.3 N or larger and 3 N or lower.

5. The apparatus for cleaning the substrate according to claim 1 , wherein
the cleaning unit has a fluid jet cleaning unit that jets two fluids to the substrate.

6. The apparatus for cleaning the substrate, according to claim 1 , further comprising
a fixing cup provided on a peripheral outer side of the rotation cup, wherein
the cleaning unit has a first cleaning unit that physically cleans a first surface of the substrate,
the first cleaning unit has a first arm that swings around a first swinging shaft, and a first cleaning member that is provided on a front-end side of the first arm and extends toward a side of the substrate and
the first cleaning member is positioned at a position away from the substrate relative to a front end of the fixing cup in a normal direction of the substrate and on a peripheral outer side of a front end of the fixing cup at a time of standby.

7. The apparatus for cleaning the substrate according to claim 1 , wherein
the cleaning unit has a second cleaning unit that physically cleans a second surface of the substrate,
the second cleaning unit has a second arm that swings around a second swinging shaft, and a second cleaning member that is provided on a front-end side of the second arm and extends toward a side of the substrate and
the second cleaning unit is positioned at a position away from the substrate relative to the rotated unit in a normal direction of the substrate at a time of standby.

8. An apparatus for cleaning a substrate comprising:
a holding unit that has a holding member holding the substrate and an elastic member that provides a biasing force to the holding member
a rotated unit connected to the holding unit;
a rotating unit that is provided on a peripheral outer side of the rotated unit and rotates the rotated unit;
a cleaning unit that physically cleans the substrate held by the holding unit; and
the apparatus for cleaning the substrate further comprising an opening device that moves the holding member to an open state by providing a force opposite to a biasing force applied by the elastic member.

9. The apparatus for cleaning the substrate according to claim 8 , wherein
the opening device approaches the holding unit from a front surface side of the substrate and moves the holding member to the open state.

10. The apparatus for cleaning the substrate according to claim 8 , wherein
the opening device has a support member that supports a back surface of the substrate when the holding member is in the open state.

11. The apparatus for cleaning the substrate according to claim 10 , wherein
the support member approaches from a front surface side of the substrate, moves to a back-surface side of the substrate, is positioned on the back-surface side of the substrate before the holding member becomes in the open state, and supports the back surface of the substrate when the holding member is in the open state.

12. The apparatus for cleaning the substrate, according to claim 11 , further comprising
a rotation cup connected to the holding unit or the rotated unit, wherein
the support member is positioned on the back-surface side of the substrate after passing through a peripheral inner side of the rotation cup and a peripheral outer side of the substrate.

13. The apparatus for cleaning the substrate according to claim 8 , wherein
the opening device has a pressing member that moves along an in-plane direction of the substrate,
the holding unit has a pressed member pressed by the pressing member, and
the holding member becomes in the open state by the pressed member being pressed by the pressing member.

14. The apparatus for cleaning the substrate, according to claim 13 , further comprising
a rotation cup connected to the holding unit or the rotated unit, wherein
the pressed member is provided between an inner periphery of the rotation cup and an outer periphery of the substrate when viewed from a front surface side of the substrate.

15. The apparatus for cleaning the substrate according to claim 8 , wherein
the holding unit has a swinging shaft that has the holding member swing along an in-plane direction of the substrate.

16. The apparatus for cleaning the substrate according to claim 15 , wherein
the holding unit has a weight member provided closer to a base end relative to the swinging shaft.

17. The apparatus for cleaning the substrate according to claim 8 , wherein
the holding unit has a plurality of holding members, and
a first biasing force provided to a certain holding member is larger than a second biasing force provided to another holding member.

18. The apparatus for cleaning the substrate according to claim 17 , wherein
the holding unit has a regulated unit for regulating movement to an inner peripheral side of the holding member,
the rotated unit has a regulating unit for regulating movement of the regulated unit, and
movement of a holding member, provided with the first biasing force, to an inner side is regulated by the regulating unit on a peripheral outer side relative to a holding member provided with the second biasing force.

19. The apparatus for cleaning the substrate, according to claim 1 , further comprising
a member including a conductive fiber and being provided adjacent to the holding unit.

20. An apparatus for cleaning a substrate comprising:
a chuck that holds the substrate;
a rotated unit connected to the chuck;
a stator that is provided on a peripheral outer side of the rotated unit and rotates the rotated unit;
a fluid jet cleaning unit or a pencil cleaning unit that physically cleans the substrate held by the chuck; and
a rotation cup connected to the rotated unit, wherein
the rotated unit is provided at a lower end of the rotation cup, and
the chuck is provided at an upper end of the rotated unit.

21. An apparatus for cleaning a substrate comprising:
a holding unit that has a chuck holding the substrate and an elastic member that provides a biasing force to the chuck,
a rotated unit connected to the chuck;
a stator that is provided on a peripheral outer side of the rotated unit and rotates the rotated unit;
a fluid jet cleaning unit or a pencil cleaning unit that physically cleans the substrate held by the chuck; and
an opening device that has a main body unit, a movement unit that moves the

Assignees

• Ebara Corp

Inventors

• Kajita Shinji
• Nakano Hisajiro
• Ishibashi Tomoatsu
• Fukaya Koichi
• Motoshima Yasuyuki
• Eto Yohei
• Oikawa Fumitoshi

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title