Coil component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11094458-B2
Application number	US-201715828091-A
Country	US
Kind code	B2
Filing date	Nov 30, 2017
Priority date	Jun 28, 2017
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.

First claim

What is claimed is:

1. A coil component, comprising:
a magnetic body, the magnetic body including:
a support member including a through hole, filled with a magnetic material, and a via hole;
a coil disposed on first and second surfaces of the support member opposing each other, the coil including a first conductive layer and a second conductive layer disposed on the first conductive layer; and
the magnetic material encapsulating the support member, the first conductive layer and the second conductive layer; and
an external electrode disposed on an external surface of the magnetic body, the external electrode being connected to the coil,
wherein the first conductive layer is continuously disposed on a side surface of the via hole and the first and second surfaces of the support member,
a difference between an average thickness of a portion of the first conductive layer disposed on the first and second surfaces of the support member and an average thickness of another portion of the first conductive layer disposed on the side surface of the via hole is 500 nm or less, and a total average thickness of the first conductive layer is 1 μm or less,
the second conductive layer includes a central plating layer disposed inside the via hole and a coil layer disposed above and below the central plating layer,
the central plating layer is integrally formed with the coil layer to be a single structure,
the second conductive layer includes a plurality of layers, the layers including a combination of an isotropic plating layer and an anisotropic plating layer,
widths of portions of the isotropic and anisotropic plating layers are substantially constant, and
a width of the isotropic plating layer is less than a width of the anisotropic plating layer.

2. The coil component of claim 1 , wherein the central plating layer and the coil layer have no interface therebetween.

3. The coil component of claim 1 , wherein a width of an upper surface of the first conductive layer disposed on the first and second surfaces of the support member is substantially the same as a width of a lower surface of the second conductive layer disposed on the first conductive layer.

4. The coil component of claim 1 , wherein the first conductive layer includes at least one of aluminum (Al), titanium (Ti), nickel (Ni), and tungsten (W).

5. The coil component of claim 1 , wherein an insulating film is further disposed on side surfaces of the first conductive layer and on side surfaces and upper or lower surfaces of the coil layer of the second conductive layer.

6. The coil component of claim 5 , wherein the insulating film has an average thickness of 1 μm or less.

7. The coil component of claim 1 , wherein a cross section of the via hole has a tapered shape whose width becomes narrow toward a center of the support member in a thickness direction.

8. The coil component of claim 1 , wherein the coil layer of the second conductive layer includes a plurality of coil layers of different widths.

Assignees

• Samsung Electro Mech

Inventors

• Bong Kang Wook
• Moon Byeong Cheol
• Kim Boum Seock
• Jang Jin Hyuk
• Ryu Joung Gul

Classifications

• H01F27/292 Primary

  Surface mounted devices · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H01F41/063

  with insulation · CPC title