Coil component and method for producing same

US9236171B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9236171-B2
Application numberUS-201113880039-A
CountryUS
Kind codeB2
Filing dateOct 14, 2011
Priority dateOct 21, 2010
Publication dateJan 12, 2016
Grant dateJan 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

First claim

Opening claim text (preview).

What is claimed is: 1. A coil component comprising: at least one insulating substrate having a first main surface, a second main surface opposite to the first main surface, a first side surface located along a first line, a second side surface located along a second line parallel to the first line, a third side surface located along a third line perpendicular to the first and second lines, a fourth side surface located along a fourth line parallel to the third line, a first notch formed at a vertex of the first and third lines, a second notch formed at a vertex of the second and third lines, a third notch formed at a vertex of the second and fourth lines, and a fourth notch formed at a vertex of the first and fourth lines; a spiral conductor formed on at least the first main surface of the insulating substrate; an upper core covering the first main surface of the insulating substrate; a lower core covering the second main surface of the insulating substrate; and first to fifth connecting portions each having pillar shape extending in normal direction of the first and second main surfaces, each of the first to fifth connecting portions being attached to the upper core at an upper end and being attached to the lower core at a lower end so as to physically connect the upper and lower cores, the first to fourth connecting portions being located in the first to fourth notches, respectively, the fifth connecting portion penetrating the insulating substrate, wherein at least one of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. 2. The coil component according to claim 1 , wherein each of the first to fourth connecting portions is disposed in contact with an edge of the insulating substrate. 3. The coil component according to claim 1 , wherein the first to fourth connecting portions are disposed inward of an area defined by the first to fourth lines. 4. The coil component according to claim 1 , further comprising a plating conductor pattern formed on the one main surface of the insulating substrate, wherein one end of the plating conductor pattern is electrically connected to the spiral conductor, the other end of the plating conductor pattern extends up to the edge of the insulating substrate, and the plating conductor pattern, at the mass production time when a plurality of coil components are formed on a single substrate, constitutes a part of a short-circuiting pattern electrically connecting the spiral conductors of adjacent coil components. 5. The coil component according to claim 1 , further comprising: a pair of terminal electrodes formed on outer peripheral surfaces of a laminated body constituted by the insulating substrate and the upper and lower cores; and an insulating film covering surfaces of the upper and lower cores, wherein the insulating film is interposed between the pair of terminal electrodes and the upper and lower cores. 6. The coil component according to claim 5 , wherein the insulating film is an insulating layer obtained by chemical conversion treatment using iron phosphate, zinc phosphate, or zirconia dispersed solution. 7. The coil component according to claim 6 , wherein the insulating film is formed of an Ni-based-ferrite-containing resin. 8. The coil component according to claim 1 , comprising a plurality of the insulating substrates, wherein the plurality of insulating substrates are laminated substantially without intervention of the metal-magnetic-powder-containing resin, and the spiral conductors formed on the respective insulating substrates are connected in parallel or in series through the pair of terminal electrodes. 9. The coil component according to claim 1 , wherein both the upper and lower cores are formed of the metal-magnetic-powder-containing resin. 10. The coil component according to claim 1 , wherein one of the upper and lower cores is formed of the metal-magnetic-powder-containing resin and the other one of the upper and lower cores is formed of a ferrite substrate.

Assignees

Inventors

Classifications

  • Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

  • with encapsulating core, e.g. made of resin and magnetic powder · CPC title

  • including permanent magnet or core · CPC title

  • Electromagnet, transformer or inductor · CPC title

  • Printed circuit coils · CPC title

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Frequently asked questions

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What does patent US9236171B2 cover?
A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a …
Who is the assignee on this patent?
Ito Tomokazu, Ohkubo Hitoshi, Maeda Yoshihiro, and 5 more
What technology area does this patent fall under?
Primary CPC classification H01F3/08. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).