Resistor component

Patent metadata

Field	Value
Publication number	US-11094436-B2
Application number	US-202016889982-A
Country	US
Kind code	B2
Filing date	Jun 2, 2020
Priority date	Dec 27, 2019
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.

First claim

What is claimed is:

1. A resistor component, comprising:
an insulating substrate;
a resistance layer disposed on one surface of the insulating substrate; and
first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer,
wherein each of the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer,
wherein the resistor component further comprises a second layer disposed between the resistance layer and the inner electrode layer, and
wherein the via electrode penetrates the resistance layer and the second layer.

2. The resistor component of claim 1 , wherein a cross-sectional area of one surface of the via electrode in contact with the one surface of the insulating surface is smaller than a cross-sectional area of another surface of the via electrode in contact with the inner electrode layer.

3. The resistor component of claim 1 , wherein the via electrode and the inner electrode layer are integrally formed.

4. The resistor component of claim 1 , wherein the via electrode is free of a resin.

5. The resistor component of claim 1 , further comprising a cover layer disposed on the second layer and extending onto at least a portion of the inner electrode layer.

6. The resistor component of claim 5 , wherein the cover layer is directly disposed on the second layer.

7. The resistor component of claim 5 , wherein the cover layer comprises a curable resin.

8. The resistor component of claim 1 , wherein the second layer includes a first portion and a second portion spaced apart from each other, the first portion disposed between the inner electrode layer of the first terminal and the resistance layer, and the second portion disposed between the inner electrode layer of the second terminal and the resistance layer.

9. The resistor component of claim 8 , wherein the first and second terminals are connected to the resistance layer only through the via electrode.

10. The resistor component of claim 1 , further comprising a cover layer disposed on the second layer and the resistance layer and extending onto at least a portion of the inner electrode layer.

11. The resistor component of claim 10 , wherein the cover layer is directly disposed on a portion of the second layer and a portion of the resistance layer.

12. The resistor component of claim 1 , wherein the first and second terminals are connected to the resistance layer only through the via electrode.

13. A resistor component, comprising:
an insulating substrate;
first and second terminals disposed on opposing end surfaces of the insulating substrate to be spaced apart from each other; and
a resistance layer disposed on one surface of the insulating substrate connecting the opposing end surfaces to each other,
wherein each of the first and second terminals comprises:
an outer electrode layer disposed on a respective one of the opposing end surfaces of the insulting substrate and extending on the one surface of the insulting substrate;
an inner electrode layer sandwiched between an extended portion of the outer electrode layer and the resistance layer; and
a via electrode extending from the inner electrode to be in contact with the one surface of the insulating substrate,
wherein the resistor component further comprises a second layer disposed between the resistance layer and the inner electrode layer, and
wherein the via electrode penetrates the resistance layer and the second layer.

14. The resistor component of claim 13 , wherein the via electrode penetrates the resistance layer.

15. The resistor component of claim 13 , wherein a cross-sectional area of one end the via electrode close to the inner electrode layer is greater than a cross-sectional area of another end the via electrode close to the insulating substrate.

16. The resistor component of claim 13 , further comprising a cover layer disposed on the second layer and extending onto at least a portion of the inner electrode layer.

17. A resistor component, comprising:
an insulating substrate;
first and second terminals disposed on opposing end surfaces of the insulating substrate to be spaced apart from each other; and
a resistance layer disposed on one surface of the insulating substrate connecting the opposing end surfaces to each other,
wherein each of the first and second terminals comprises:
an outer electrode layer disposed on a respective one of the opposing end surfaces of the insulting substrate and extending on the one surface of the insulting substrate;
an inner electrode layer sandwiched between an extended portion of the outer electrode layer and the resistance layer; and
a via electrode extending from the inner electrode to be in contact with the one surface of the insulating substrate,
wherein the resistor component further comprises a second layer disposed between the resistance layer and the inner electrode layer, and
wherein the resistor component further comprises a cover layer disposed on the second layer and extending onto at least a portion of the inner electrode layer.

Assignees

• Samsung Electro Mech

Inventors

• Yoon Ji Sook
• Park Kwang Hyun

Classifications

• H01C1/14 Primary

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C1/034 Primary

  the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) · CPC title

• H01C17/065

  by thick film techniques, e.g. serigraphy · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title