Resistor element and resistor element assembly

Patent metadata

Field	Value
Publication number	US-10347404-B2
Application number	US-201715652927-A
Country	US
Kind code	B2
Filing date	Jul 18, 2017
Priority date	Oct 31, 2016
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.

First claim

What is claimed is:

1. A resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate;
first and second terminals respectively on the first and second end surfaces; and
a second resistor layer on the first resistor layer, connected to the first and second terminals,
wherein the first resistor layer comprises a first composition with a first thermoelectromotive force, the second resistor layer comprises a second composition with a second thermoelectromotive force, and an absolute value of the second thermoelectromotive force is smaller than an absolute value of the first thermoelectromotive force.

2. The resistor element of claim 1 , wherein the first resistor layer comprises a copper-nickel (Cu—Ni)-based composition and the second resistor layer comprises a copper-manganese-tin (Cu—Mn—Sn)-based composition.

3. The resistor element of claim 1 , wherein the first and second terminals are connected to respective opposing end portions of both the first and second resistor layers, and the first and second resistor layers are bonded to each other.

4. The resistor element of claim 1 , wherein the second resistor layer is between the first resistor layer and the first terminal and between the first resistor layer and the second terminal.

5. The resistor element of claim 4 , wherein the second resistor layer comprises first and second resistors separated across the first resistor layer, with the first resistor between the first resistor layer and the first terminal and the second resistor between the first resistor layer and the second terminal.

6. The resistor element of claim 1 , wherein the first and second resistor layers each include a region removed by a trimming process.

7. The resistor element of claim 1 , further comprising:
a first protective layer on the first and second resistor layers and including glass; and
a second protective layer on the first protective layer and including a polymer.

8. The resistor element of claim 1 , wherein the first and second terminals respectively include first and second internal electrodes on the base substrate, and respectively include first and second external electrodes respectively on the first and second internal electrodes.

9. The resistor element of claim 1 , wherein a material of the second resistor layer has an absolute value of a temperature coefficient of resistivity (TCR) of 100 ppm/° C. or less.

10. The resistor element of claim 1 , wherein the first resistor layer further comprises glass, and is bonded to the base substrate by a firing process after being printed in a paste form.

11. A resistor element assembly comprising:
a circuit board having a plurality of electrode pads; and
a resistor element on the circuit board and electrically connected to the plurality of electrode pads,
the resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate;
first and second terminals respectively on the first and second end surfaces; and
a second resistor layer on the first resistor layer, connected to the first and second terminals,
wherein the first resistor layer comprises a first composition with a first thermoelectromotive force, the second resistor layer comprises a second composition with a second thermoelectromotive force, and an absolute value of the second thermoelectromotive force is smaller than an absolute value of the first thermoelectromotive force.

12. The resistor element assembly of claim 11 , wherein the first resistor layer comprises a Cu—Ni-based composition and the second resistor layer comprises a copper-manganese-tin (Cu—Mn—Sn)-based composition.

13. The resistor element assembly of claim 11 , wherein the first and second terminals are connected to respective opposing end portions of both the first and second resistor layers, and the first and second resistor layers are bonded to each other.

14. The resistor element assembly of claim 11 , wherein the second resistor layer is between the first resistor layer and the first terminal and between the first resistor layer and the second terminal.

15. The resistor element assembly of claim 14 , wherein the second resistor layer comprises first and second resistors separated across the first resistor layer, with the first resistor between the first resistor layer and the first terminal and the second resistor between the first resistor layer and the second terminal.

16. A resistor element comprising:
a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces;
a first resistor layer on the first surface of the base substrate and spaced apart from the first and second end surfaces;
first and second terminals respectively on the first and second end surfaces of the base substrate, and each extending on a portion of the first surface of the base substrate; and
a second resistor layer on the first resistor layer and connected to the first and second terminals,
wherein the first resistor layer comprises a first composition with a first thermoelectromotive force, the second resistor layer comprises a second composition with a second thermoelectromotive force, and an absolute value of the second thermoelectromotive force is smaller than an absolute value of the first thermoelectromotive force.

17. The resistor element of claim 16 , wherein:
the first composition is a copper-nickel (Cu—Ni)-based composition, and
the second composition is a copper-manganese-tin (Cu—Mn—Sn)-based composition.

18. The resistor element of claim 16 , further comprising:
a first protective layer on the second resistor layer; and
a second protective layer on the first protective layer,
wherein the first resistor layer, the second resistor layer, and the first protective layer each include a region removed by a trimming process.

19. The resistor element of claim 16 , wherein the second resistor layer comprises:
a first resistor between the first resistor layer and the portion of the first terminal extending on the first surface of the base substrate; and
a second resistor between the first resistor layer and the portion of the second terminal extending on the first surface of the base substrate.

Assignees

• Samsung Electro Mech

Inventors

• Park Kwang Hyun
• Yun Jang Seok
• Baek Kyung Seon

Classifications

• H01C7/18 Primary

  comprising a plurality of layers stacked between terminals · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C17/24

  by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence) · CPC title

• H01C17/06526 Primary

  composed of metals · CPC title

• H01C1/01

  Mounting; Supporting · CPC title