Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-11091849-B2 · Aug 17, 2021 · US
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Sperling Jan patents
Sperling Jan is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sperling Jan |
| Total patents | 10 |
| First publication | Dec 3, 2015 |
| Latest publication | Aug 17, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of forming a solderable solder deposit on a contact pad
US-11032914-B2 · Jun 8, 2021 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-2020392637-A1 · Dec 17, 2020 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-10793962-B2 · Oct 6, 2020 · US
Process for indium or indium alloy deposition and article
US-10753007-B2 · Aug 25, 2020 · US
A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-2020199766-A1 · Jun 25, 2020 · US
Method of forming a solderable solder deposit on a contact pad
US-2019350088-A1 · Nov 14, 2019 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-2018355500-A1 · Dec 13, 2018 · US
Process for indium or indium alloy deposition and article
US-2018298511-A1 · Oct 18, 2018 · US
Method for metallization of solar cell substrates
US-2015349152-A1 · Dec 3, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.