Acidic aqueous composition for electrolytic copper plating
US-12071702-B2 · Aug 27, 2024 · US
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Rohde Dirk patents
Rohde Dirk is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rohde Dirk |
| Total patents | 18 |
| First publication | Oct 22, 2015 |
| Latest publication | Aug 27, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Acidic aqueous composition for electrolytic copper plating
US-2021262105-A1 · Aug 26, 2021 · US
Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-11091849-B2 · Aug 17, 2021 · US
Acidic aqueous composition for electrolytic copper plating
US-11035051-B2 · Jun 15, 2021 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-2020392637-A1 · Dec 17, 2020 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-10793962-B2 · Oct 6, 2020 · US
Process for indium or indium alloy deposition and article
US-10753007-B2 · Aug 25, 2020 · US
A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-2020199766-A1 · Jun 25, 2020 · US
Copper plating bath composition and method for deposition of copper
US-10633755-B2 · Apr 28, 2020 · US
Electrolytic copper plating bath compositions and a method for their use
US-10538850-B2 · Jan 21, 2020 · US
Recent patents
Latest publications not already listed above.
Acidic aqueous composition for electrolytic copper plating
US-2019203369-A1 · Jul 4, 2019 · US
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
US-2018355500-A1 · Dec 13, 2018 · US
Process for indium or indium alloy deposition and article
US-2018298511-A1 · Oct 18, 2018 · US
Copper plating bath composition and method for deposition of copper
US-2018237932-A1 · Aug 23, 2018 · US
Electrolytic copper plating bath compositions and a method for their use
US-2018112320-A1 · Apr 26, 2018 · US
Copper plating bath composition
US-9551080-B2 · Jan 24, 2017 · US
Method for copper plating
US-9506158-B2 · Nov 29, 2016 · US
Copper plating bath composition
US-2015299883-A1 · Oct 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 18 |
| Rohde Dirk | 1 |
| Roelfs Bernd | 1 |
| Higuchi Jun | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.