Integrated assemblies having voids along regions of gates, and methods of forming conductive structures

Patent metadata

Field	Value
Publication number	US-11088142-B2
Application number	US-201916727153-A
Country	US
Kind code	B2
Filing date	Dec 26, 2019
Priority date	Dec 26, 2019
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

Some embodiments include an integrated assembly with a semiconductor-material-structure having a first source/drain region, a second source/drain region, and a channel region between the first and second source/drain regions. The semiconductor-material-structure has a first side and an opposing second side. A first conductive structure is adjacent to the first side and is operatively proximate the channel region to gatedly control coupling of the first and second source/drain regions through the channel region. A second conductive structure is adjacent to the second side and is spaced from the second side by an intervening region which includes a void. Some embodiments include methods of forming integrated assemblies.

First claim

I claim:

1. An integrated assembly, comprising:
a semiconductor-material-structure having a first source/drain region, a second source/drain region, and a channel region between the first and second source/drain regions; the semiconductor-material-structure having a first side and an opposing second side;
a first conductive structure adjacent the first side and operatively proximate the channel region to gatedly control coupling of the first and second source/drain regions through the channel region; and
a second conductive structure adjacent the second side and spaced from the second side by an intervening region which includes a void.

2. The integrated assembly of claim 1 wherein the semiconductor material of the semiconductor-material-structure comprises silicon.

3. The integrated assembly of claim 1 wherein the first source/drain region is coupled with a digit line, and wherein the second source/drain region is coupled with a storage element.

4. The integrated assembly of claim 3 wherein the storage element is a capacitor.

5. The integrated assembly of claim 1 wherein the intervening region includes carbon-doped silicon dioxide between the semiconductor-material-structure and the void.

6. The integrated assembly of claim 5 wherein the carbon concentration within the carbon-doped silicon dioxide is at least about 1 at %.

7. The integrated assembly of claim 5 wherein the carbon concentration within the carbon-doped silicon dioxide is at least about 5 at %.

8. The integrated assembly of claim 5 wherein the carbon concentration within the carbon-doped silicon dioxide is at least about 10 at %.

9. The integrated assembly of claim 1 wherein first conductive structure is spaced from the first side by only an insulative material comprising silicon dioxide.

10. The integrated assembly of claim 1 wherein the first and second conductive structures each include a metal-containing-region directly against a doped-semiconductor-containing-region.

11. Integrated memory, comprising:
digit lines extending along a first direction;
semiconductor structures extending upwardly from the digit lines; the semiconductor structures including pillars; each of the pillars having an upper source/drain region and a channel region beneath the upper source/drain region; the semiconductor structures including lower source/drain regions beneath the channel regions; the lower source/drain regions being coupled with the digit lines;
storage elements coupled with the upper source/drain regions;
gate lines extending along a second direction which crosses the first direction; and
each of the gate lines having a first side and an opposing second side; a first set of the semiconductor structures being along the first side of an associated one of the gate lines, and a second set of the semiconductor structures being along the second side of said associated one of the gate lines; the channel regions within the first set of the semiconductor structures being operatively proximate the adjacent first side of said associated one of the gate lines so that said associated one of the gate lines provides gated control of the channel regions within the first set of the semiconductor structures; the channel regions within the second set of the semiconductor structures being spaced from the adjacent second side of said associated one of the gate lines by intervening regions which include voids.

12. The integrated memory of claim 11 wherein upper regions of the voids are capped by insulative material.

13. The integrated memory of claim 12 wherein the insulative material comprises silicon dioxide.

14. The integrated memory of claim 11 wherein the intervening regions include carbon-doped silicon dioxide.

15. The integrated memory of claim 14 wherein the carbon-doped silicon dioxide within each of the intervening regions is directly against one of the pillars.

16. The integrated memory of claim 11 wherein each of the gate lines comprises a metal-containing-region directly against a doped-semiconductor-containing-region.

17. The integrated memory of claim 11 wherein the gate lines cross over the digit lines and are spaced from the digit lines by intervening regions which include insulative regions comprising silicon nitride and carbon-doped silicon dioxide.

18. The integrated memory of claim 17 wherein the silicon nitride is over the carbon-doped silicon dioxide, and wherein the insulative regions further include silicon dioxide over the silicon nitride.

19. The integrated memory of claim 11 wherein the digit lines are coupled with sense-amplifier-circuitry; and wherein said sense-amplifier-circuitry is under the digit lines.

20. The integrated memory of claim 11 wherein the gate lines are coupled with driver circuitry; and wherein said driver circuitry is under the digit lines.

Assignees

• Micron Technology Inc

Inventors

• Tang Sanh D

Classifications

• H01L27/10814 Primary

  Electricity · mapped topic

• H01L27/10873

  Electricity · mapped topic

• H01L27/10852

  Electricity · mapped topic

• H01L27/10885

  Electricity · mapped topic

• H01L27/10891

  Electricity · mapped topic