Integrated assemblies having voids along regions of gates, and methods of forming conductive structures
US-12150292-B2 · Nov 19, 2024 · US
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Patent family 76546685
This patent family groups 6 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 76546685 |
| Family type | — |
| Earliest priority | Dec 26, 2019 |
| First filing country | US |
| Member publications | 6 |
| Countries | US |
| Representative publication | US12150292B2 — Integrated assemblies having voids along regions of gates, and methods of forming conductive structures |
Representative publication
Best representative member for this family based on priority and filing country.
US12150292B2 — Integrated assemblies having voids along regions of gates, and methods of forming conductive structures (published Nov 19, 2024)
Member publications
Related publications in this family.
Integrated Assemblies Having Voids Along Regions of Gates, and Methods of Forming Conductive Structures
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US-2021265356-A1 · Aug 26, 2021 · US
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Integrated Assemblies Having Voids Along Regions of Gates, and Methods of Forming Conductive Structures
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