Method for etching the surface of aluminum fragments, aluminum fragments with an etched surface and material composites containing such fragments

US11085117B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11085117-B2
Application numberUS-201716077436-A
CountryUS
Kind codeB2
Filing dateJan 9, 2017
Priority dateFeb 11, 2016
Publication dateAug 10, 2021
Grant dateAug 10, 2021

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Abstract

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A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for 0.5 to 10 minutes while stirring in such a way that the fragments are entrained by the motion of the etching solution; e. stopping the etching by diluting the etching solution with water; f. removing the etched fragments; g. repeatedly rinsing the fragments with water and h. rinsing the fragments with an organic desiccant. An etched fragment of aluminum or an aluminum alloy and also to a composite material comprising etched fragments.

First claim

Opening claim text (preview).

The invention claimed is: 1. An aluminum or aluminum alloy fragment etching method comprising the steps of: a. providing a hydrochloric acid solution having a concentration of 1.1 to 4.2 moles HCl per liter of water in a trough- or vat-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving a quantity of aluminum from the interval 0.5 g to 17.5 g per liter to produce an etching solution; c. adding aluminum or aluminum alloy fragments to the etching solution immediately after the inoculation; d. etching the aluminum or aluminum alloy fragments for 0.5 to 10 minutes while circulating the etching solution with the fragments such that the fragments are entrained by the movement of the etching solution to produce etched aluminum or aluminum alloy fragments; e. stopping the etching within a few seconds by diluting the etching solution with water; f. removing the etched aluminum or aluminum alloy fragments from the etching solution; g. repeatedly rinsing of etched aluminum or aluminum alloy fragments with water immediately after the removal and h. rinsing the etched aluminum or aluminum alloy fragments with an organic desiccant. 2. The etching method according to claim 1 , wherein the hydrochloric acid solution has a concentration of 1.7 to 2.5 mol of HCl per liter of water. 3. The etching method according to claim 1 , wherein the hydrochloric acid solution has a concentration of 2.1 mol of HCl per liter of water. 4. The etching method according to claim 1 , further comprising seeding the hydrochloric acid solution by chemically dissolving 2 to 2.5 g of aluminum per liter. 5. The etching method according to claim 1 , wherein the aluminum or aluminum alloy fragments are etched while circulating the etching solution with the aluminum or aluminum alloy fragments for 4 to 5 minutes. 6. An etched fragment made of aluminum or an aluminum alloy produced by the method according to claim 1 , wherein the surface of the etched aluminum or aluminum alloy fragment has anchoring structures, wherein the shape of the fragment corresponds to its shape before the etching, wherein the fragment is a wire having a wire diameter of at least 50 micrometers and a length of at least 0.5 millimeter. 7. The etched aluminum or aluminum alloy fragment according to claim 6 , wherein the etched aluminum or aluminum alloy fragment is a tetrapod.

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What does patent US11085117B2 cover?
A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for…
Who is the assignee on this patent?
Univ Kiel Christian Albrechts
What technology area does this patent fall under?
Primary CPC classification C23F1/20. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).