Scatterometry based methods and systems for measurement of strain in semiconductor structures

Patent metadata

Field	Value
Publication number	US-11060846-B2
Application number	US-201916660492-A
Country	US
Kind code	B2
Filing date	Oct 22, 2019
Priority date	Dec 19, 2018
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

Methods and systems for measuring optical properties of transistor channel structures and linking the optical properties to the state of strain are presented herein. Optical scatterometry measurements of strain are performed on metrology targets that closely mimic partially manufactured, real device structures. In one aspect, optical scatterometry is employed to measure uniaxial strain in a semiconductor channel based on differences in measured spectra along and across the semiconductor channel. In a further aspect, the effect of strain on measured spectra is decorrelated from other contributors, such as the geometry and material properties of structures captured in the measurement. In another aspect, measurements are performed on a metrology target pair including a strained metrology target and a corresponding unstrained metrology target to resolve the geometry of the metrology target under measurement and to provide a reference for the estimation of the absolute value of strain.

First claim

What is claimed is:

1. An optical metrology system comprising:
an illumination subsystem configured to illuminate a metrology target including a first array of partially fabricated transistor devices with a first amount of illumination light having an electric field at a first orientation with respect to the metrology target and a second amount of illumination light having a second orientation with respect to the metrology target;
a detector configured to detect a first amount of measurement data associated with measurements of the metrology target in response to the first amount of illumination light and a second amount of measurement data associated with measurements of the metrology target in response to the second amount of illumination light; and
a computing system configured to:
estimate a value indicative of a strain present along a channel of each of the partially fabricated transistor devices based on a difference between the first and second amounts of measurement data.

2. The optical metrology system of claim 1 , wherein the estimating the value indicative of the strain involves determining a first value of a band structure characteristic of the channel structure based on the first amount of measurement data, determining a second value of the band structure characteristic of the channel structure based on the second amount of measurement data, wherein the value indicative of the strain present along the channel is a difference between the first and second values of the band structure characteristic.

3. The optical metrology system of claim 2 , wherein the band structure characteristic is the optical band gap.

4. The optical metrology system of claim 1 , wherein the first orientation of the electric field with respect to the metrology target is the electric field aligned with a length of extent of the channel structure from a source structure to a drain structure of each of the partially fabricated transistor devices, and wherein the second orientation of the electric field with respect to the metrology target is orthogonal to the first orientation.

5. The optical metrology system of claim 1 , wherein the electric field is oriented at the first orientation with respect to the metrology target at a first azimuth angle of a spectroscopic ellipsometer and the electric field is oriented at the second orientation with respect to the metrology target at a second azimuth angle of the spectroscopic ellipsometer.

6. The optical metrology system of claim 1 , wherein the electric field is oriented at the first orientation with respect to the metrology target at a first polarization angle of a spectroscopic reflectometer and the electric field is oriented at the second orientation with respect to the metrology target at a second polarization angle of the spectroscopic reflectometer.

7. The optical metrology system of claim 2 , wherein the determining of the first value of the band structure characteristic of the channel structure and the determining of the second value of the band structure characteristic of the channel structure is performed by a trained, machine learning based measurement model.

8. The optical metrology system of claim 1 , further comprising:
measuring a geometric profile of the metrology target with a reference metrology system different from the optical metrology system, wherein the measured geometric profile is provided as input to a measurement model that estimates the value indicative of the strain present along the channel.

9. The optical metrology system of claim 8 , wherein the reference metrology system is an electron based or an x-ray based metrology system.

10. The optical metrology system of claim 1 , further comprising:
measuring a material composition of a source structure coupled to the channel structure or a drain structure coupled to the channel structure, or both, with a reference metrology system different from the optical metrology system, wherein the measured material composition is provided as input to a measurement model that estimates the value indicative of the strain present along the channel.

11. The optical metrology system of claim 1 , wherein the computing system is further configured to:
estimate a value of one or more electrical test results of a finished transistor device fabricated from one of the first array of partially fabricated transistor devices based on the value indicative of the strain present along the channel.

12. An optical metrology system comprising:
an illumination subsystem configured to illuminate a first array of partially fabricated transistor devices of a metrology target with a first amount of illumination light having an electric field at a first orientation with respect to the metrology target and illuminate a second array of partially fabricated transistor devices of the metrology target with a second amount of illumination light having an electric field at the first orientation with respect to the metrology target, wherein the first array of partially fabricated transistor devices have a strained channel structure and the second array of partially fabricated transistor devices have an unstrained channel structure;
a detector configured to detect a first amount of measurement data associated with measurements of the metrology target in response to the first amount of illumination light and a second amount of measurement data associated with measurements of the metrology target in response to the second amount of illumination light; and
a computing system configured to:
estimate a value indicative of a strain present along a channel of each of the partially fabricated transistor devices based on a difference between the first and second amounts of measurement data.

13. The optical metrology system of claim 12 , wherein the estimating the value indicative of the strain involves determining a value of a band gap of the strained channel structure based on the first amount of measurement data, determining a value of a band gap of the unstrained channel structure based on the second amount of measurement data, and wherein the value indicative of the strain present along the strained channel structure is based on a difference between the values of the band gap of the strained and unstrained channel structures.

14. The optical metrology system of claim 12 , wherein the computing system is further configured to:
estimate a geometric profile of the partially fabricated transistor devices having the unstrained channel structure based on the second amount of measurement data, and wherein the estimated geometric profile is provided as input to a measurement model that estimates the value indicative of the strain present along the channel based on the first and second amounts of measurement data.

15. The optical metrology system of claim 12 , wherein the computing system is further configured to:
estimate a geometric profile of the partially fabricated transistor devices having the unstrained channel structure and estimate the value indicative of the strain present along the channel in a combined analysis of the first and second amounts of measurement data.

16. The optical metrology system of claim 12 , wherein the second array of partially fabricated transistor devices having the unstrained channel structure include a channel structure without an epitaxial source structure and an epitaxial drain structure fabricated at either end of the channel structure.

17. The optical metrology system of claim 12 , wherein the second array of partially fabricated transistor devices having the unstrained channel structure incl

Assignees

• Kla Corp

Inventors

• Chouaib Houssam
• Rosenberg Aaron
• Lin Kai-Hsiang
• Hu Dawei
• Tan Zhengquan

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10D30/751

  having composition variations in the channel regions · CPC title

• G06T7/0004

  Industrial image inspection · CPC title

• G01N21/95607 Primary

  using a comparative method · CPC title

• G01N21/9501

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title