Solder processing apparatus
US-2025339912-A1 · Nov 6, 2025 · US
with dipping means
with dipping means · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/0669 |
| Official title | {with dipping means} |
| Display label | with dipping means |
| Total patents | 37 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 4 |
| 2019 | 5 |
| 2020 | 6 |
| 2021 | 7 |
| 2022 | 2 |
| 2023 | 6 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Coating device and component mounting machine
US-12262480-B2 · Mar 25, 2025 · US
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US-11731207-B2 · Aug 22, 2023 · US
Coating device and component mounting machine
US-2023247772-A1 · Aug 3, 2023 · US
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US-2023121381-A1 · Apr 20, 2023 · US
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US-11602800-B2 · Mar 14, 2023 · US
Zinc-cobalt barrier for interface in solder bond applications
US-11587858-B2 · Feb 21, 2023 · US
Method for selectively pretinning a guidewire core
US-11548086-B2 · Jan 10, 2023 · US
Component mounting machine
US-11503752-B2 · Nov 15, 2022 · US
Bonding device and method in microcomponent process and welding-agent placing unit
US-2022045252-A1 · Feb 10, 2022 · US
Wire automatic soldering system
US-11141807-B2 · Oct 12, 2021 · US
Zinc-cobalt barrier for interface in solder bond applications
US-2021280547-A1 · Sep 9, 2021 · US
Soldering apparatus and soldering method
US-11059119-B2 · Jul 13, 2021 · US
Soldering method and soldering apparatus
US-11059117-B2 · Jul 13, 2021 · US
Zinc-cobalt barrier for interface in solder bond applications
US-11011488-B2 · May 18, 2021 · US
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US-2021107080-A1 · Apr 15, 2021 · US
Semiconductor fabrication apparatus and semiconductor fabrication method
US-10892240-B2 · Jan 12, 2021 · US
Soldering apparatus and soldering method
US-2020331086-A1 · Oct 22, 2020 · US
Soldering method and soldering apparatus
US-2020254549-A1 · Aug 13, 2020 · US
Method for selectively pretinning a guidewire core
US-2020122258-A1 · Apr 23, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/0669?
- CPC B23K3/0669 is the Cooperative Patent Classification code for “with dipping means.”
- How many patents are filed under CPC B23K3/0669 (with dipping means)?
- Our database includes 37 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/0669 growing?
- Publication counts under this code: 6 in 2023 vs 2 in 2025 (latest complete years).