Planarization process, apparatus and method of manufacturing an article

Patent metadata

Field	Value
Publication number	US-11043407-B2
Application number	US-201916542066-A
Country	US
Kind code	B2
Filing date	Aug 15, 2019
Priority date	Aug 15, 2019
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A method, comprising retaining a superstrate with a superstrate chuck; applying a pressure to deflect the superstrate toward a substrate, deflection of the superstrate being gradually extended along a radial direction; maintaining a vacuum applied to a perimeter of the superstrate and continuously retaining the superstrate with the chuck while the deflecting the superstrate by the pressure; releasing the vacuum from the perimeter of the superstrate; and releasing the superstrate from the chuck.

First claim

What is claimed is:

1. A method, comprising:
retaining a superstrate with a superstrate chuck, the superstrate chuck including a center zone aligned with a center portion of the superstrate and a series of ring zones, the series of ring zones including a peripheral ring zone aligned with a perimeter of the superstrate and a plurality of inner ring zones between the center zone and the peripheral ring zone;
applying a pressure to deflect the superstrate toward a substrate to gradually extend deflection of the superstrate along a radial direction, further comprising:
applying the pressure through the center zone and maintaining the vacuum applied through the series of ring zones;
sequentially releasing the vacuum from the inner ring zones and applying the pressure through the inner ring zones sequentially in the radial direction after the center portion of the superstrate has been deflected by the pressure; and
releasing the vacuum from the peripheral ring zone;

and
releasing the superstrate from the chuck.

2. The method of claim 1 , further comprising:
dispensing a formable material contact on the substrate;
contacting the superstrate with the formidable material contact; and
applying the pressure to superstrate corresponding to a flow front of the formable material contact.

3. The method of claim 2 , wherein the formable material contact is dispensed as a plurality of droplets deposited on the substrate.

4. The method of claim 1 , wherein the pressure is applied to the center zone to control an initial height at a determined range and maintaining a predetermined curvature of the superstrate.

5. The method of claim 1 , further comprising:
curing the formable material contact after the superstrate is released from the chuck;
moving a lateral position of the superstrate relative to a curing source during curing;
re-retaining the superstrate with the chuck; and
separating the superstrate from the cured formable material contact.

6. A multi-zone chucking system, comprising:
a substrate chuck for retaining a substrate;
a superstrate chuck for retaining a superstrate, the superstrate chuck including a center zone to be aligned with a center portion of the superstrate, a peripheral ring zone aligned with a perimeter of the superstrate and a plurality of inner ring zones between the center zone and the peripheral ring zones; and
a pressure source configured to apply pressure and vacuum to the superstrate via a plurality ports of the superstrate chuck, wherein
the pressure source is configured to:
apply the pressure sequentially to a plurality of regions of the superstrate through the ports in the inner ring zones such that the superstrate is deflected towards the substrate gradually from one region to another in a radial direction, and
maintain the vacuum applied to the perimeter of the superstrate while the superstrate is deflected by the pressure.

7. The multi-zone chucking system of claim 6 , wherein the center zone of the superstrate chuck includes an air cavity to be aligned with a center of the superstrate while contacting the superstrate with a formable material on the substrate.

8. The multi-zone chucking system of claim 6 , further comprising a formable material dispenser configured to dispensing a plurality of droplets of the formable material on the substrate, wherein:
the superstrate chuck is configured to advance the superstrate to contact with the formable material on the substrate; and
the pressure source is configured to sequentially apply the pressure to the regions corresponding to a flow front of the formable material.

9. The multi-zone chucking system of claim 8 , further comprising a curing source configured to cure the formable material after the superstrate is released from the superstrate chuck.

10. The multi-zone chucking system of claim 9 , wherein the substrate chuck is configured to move a lateral position of the substrate relative to the curing source.

11. The multi-zone chucking system of claim 9 , wherein the curing source is configured to control a size of light beam with reference to a diameter of the superstrate during curing.

12. The multi-zone chucking system of claim 9 , wherein the curing source is configured to control a tilting angle of the light beam incident on the superstrate.

13. A method for forming a layer, comprising:
dispensing a formable material on a substrate;
retaining a superstrate with a chuck, and advancing the superstrate to contact with the formable material by the chuck, the chuck comprising a center zone aligned with a center portion of the superstrate and a peripheral ring zone aligned with a perimeter of the superstrate and a plurality of inner ring zones between the center zone and the peripheral ring zone;
applying a pressure sequentially to a plurality of regions of the superstrate through the inner ring zones such that the superstrate is deflected towards the substrate gradually from one region to another in a radial direction;
releasing vacuum applied to the another region sequentially while the pressure is applied thereto;
continuously applying a vacuum to a perimeter of the superstrate while the superstrate is deflected by the pressure;
releasing the superstrate from the chuck; and
curing the formable material after the chuck with a curing source.

14. The method of claim 13 , further comprising moving a lateral position of the substrate relative to the curing source during curing.

15. The method of claim 13 , further comprising controlling a size of light beam of the curing source with reference to a diameter of the superstrate.

16. The method of claim 13 , further comprising controlling a tilting angle of the light beam incident on the superstrate.

17. The method of claim 13 , further comprising:
re-retaining the superstrate by the superstrate chuck; and
separating the superstrate from the cured formable material.

Assignees

• Canon Kk

Inventors

• Choi Byung-Jin
• Bamesberger Seth J
• Saito Masaki
• Ozturk Ozkan

Classifications

• H10P95/06

  Planarisation of inorganic insulating materials · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/7624 Primary

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title