Polyamide-imides, graphite films and preparation for the graphite film
US-9371233-B2 · Jun 21, 2016 · US
Thermally conductive resin and thermal interface material comprising the same
US10329468B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10329468-B2 |
| Application number | US-201615046973-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2016 |
| Priority date | Dec 7, 2015 |
| Publication date | Jun 25, 2019 |
| Grant date | Jun 25, 2019 |
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- Title
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Abstract
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A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X 1 is X 2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermally conductive resin, represented by formula (I): wherein X 1 is X 2 is m is an integer ranging from 5 to 30, n is an integer ranging from 5 to 15, and o is an integer ranging from 40 to 80, wherein m:n:o=5-30:5-15:40-80. 2. A thermal interface material comprising a thermally conductive resin as claimed in claim 1 . 3. The thermal interface material as claimed in claim 2 , further comprising thermally conductive powder mixed in the thermal interface material. 4. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder comprises ceramic powder. 5. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder comprises boron nitride, silicon carbide, aluminum nitride or aluminum oxide. 6. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder has a weight ratio less than or equal to 50% in the thermal interface material.
Assignees
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Classifications
of aluminium · CPC title
- C08G73/14Primary
Polyamide-imides · CPC title
- C09K5/14Primary
Solid materials, e.g. powdery or granular · CPC title
from tetracarboxylic acids or derivatives and diisocyanates · CPC title
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title
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- What does patent US10329468B2 cover?
- A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X 1 is X 2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is al…
- Who is the assignee on this patent?
- Ind Tech Res Inst
- What technology area does this patent fall under?
- Primary CPC classification C08G73/14. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 25 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).