Method for producing an electronic device and electronic device
US-10886426-B2 · Jan 5, 2021 · US
Method of producing an optoelectronic component
US11038090B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11038090-B2 |
| Application number | US-201816632613-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2018 |
| Priority date | Aug 1, 2017 |
| Publication date | Jun 15, 2021 |
| Grant date | Jun 15, 2021 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of manufacturing an optoelectronic component comprising: providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring. 2. The method as claimed in claim 1 , wherein before removal of a portion of the casting material at the cast surface the casting material is hardened. 3. The method as claimed in claim 1 , wherein the casting material comprises embedded particles. 4. The method as claimed in claim 3 , wherein particles are exposed by removal of a portion of the casting material at the cast surface. 5. The method as claimed in claim 3 , wherein particles are released from the casting material when a portion of the casting material at the cast surface is removed. 6. The method as claimed in claim 1 , wherein the casting material comprises a wavelength-converting fluorescent material.
Assignees
Inventors
Classifications
Scattering means (H10H20/82 takes precedence) · CPC title
of encapsulations · CPC title
of wavelength conversion means · CPC title
Wavelength conversion materials · CPC title
characterised by their material, e.g. epoxy or silicone resins · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11038090B2 cover?
- A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a …
- Who is the assignee on this patent?
- Osram Oled Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/853. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 15 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).