Power semiconductor devices with bond pads having structural support layers
US-2026090443-A1 · Mar 26, 2026 · US
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Richter Daniel patents
Richter Daniel is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Richter Daniel |
| Total patents | 36 |
| First publication | Feb 4, 2016 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices having inner gate runners with non-orthogonal inner segments
US-2026059837-A1 · Feb 26, 2026 · US
Encapsulation delamination prevention structures at die edge
US-2026053057-A1 · Feb 19, 2026 · US
Non-continuous pad structure for power semiconductor devices and power semiconductor devices including non-continuous pad structures
US-2026047470-A1 · Feb 12, 2026 · US
Opening pack
US-2026015156-A1 · Jan 15, 2026 · US
Semiconductor devices having metal gate runners with asymmetric outer gate runners, unevenly-spaced inner gate runners and/or spine-rib inner gate runners with multiple ribs
US-2025343117-A1 · Nov 6, 2025 · US
Opening pack
US-12421019-B2 · Sep 23, 2025 · US
Electronic device with top side pin array and manufacturing method thereof
US-2025167007-A1 · May 22, 2025 · US
Tray with base, dome and brim
US-2025083879-A1 · Mar 13, 2025 · US
Electronic device with top side pin array and manufacturing method thereof
US-12205827-B2 · Jan 21, 2025 · US
Recent patents
Latest publications not already listed above.
Tray with base, dome and brim
US-12151861-B2 · Nov 26, 2024 · US
Opening pack
US-2024124217-A1 · Apr 18, 2024 · US
Method and system for packing optimization of semiconductor devices
US-11916033-B2 · Feb 27, 2024 · US
Opening pack
US-11858720-B2 · Jan 2, 2024 · US
Power semiconductor devices having moisture barriers
US-2023378010-A1 · Nov 23, 2023 · US
Die backside metallization methods and apparatus
US-2023326897-A1 · Oct 12, 2023 · US
Opening pack
US-2023089799-A1 · Mar 23, 2023 · US
Opening pack
US-11511931-B2 · Nov 29, 2022 · US
Tray with base, dome and brim
US-2022297906-A1 · Sep 22, 2022 · US
Method and System for Packing Optimization of Semiconductor Devices
US-2022157755-A1 · May 19, 2022 · US
Lid with integrated storage
US-2022135297-A1 · May 5, 2022 · US
Method and system for packing optimization of semiconductor devices
US-11239192-B2 · Feb 1, 2022 · US
Opening pack
US-2021114798-A1 · Apr 22, 2021 · US
Opening pack
US-10926943-B2 · Feb 23, 2021 · US
Electronic device with top side pin array and manufacturing method thereof
US-2021043465-A1 · Feb 11, 2021 · US
Method and System for Packing Optimization of Semiconductor Devices
US-2020357763-A1 · Nov 12, 2020 · US
Electronic device with top side pin array and manufacturing method thereof
US-10832921-B2 · Nov 10, 2020 · US
Method and system for packing optimization of semiconductor devices
US-10734343-B2 · Aug 4, 2020 · US
Opening pack
US-2020122916-A1 · Apr 23, 2020 · US
Display carton
US-10538349-B2 · Jan 21, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Altria Client Services Llc | 14 |
| Amkor Technology Inc | 8 |
| Wolfspeed Inc | 7 |
| Amkor Tech Singapore Holding Pte Ltd | 5 |
| Amkor Tech Singapore Pte Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 15 |
| H10W72/07236 | 14 |
| H10W72/252 | 14 |
| H10W72/234 | 14 |
| H10W72/232 | 14 |