Light emitting device with sealing member containing filler particles

Patent metadata

Field	Value
Publication number	US-9231175-B2
Application number	US-201113337154-A
Country	US
Kind code	B2
Filing date	Dec 26, 2011
Priority date	Dec 28, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A light emitting device includes a base substrate, a light emitting element, and a sealing member. The light emitting element is provided on the base substrate. The sealing member seals the light emitting element. The sealing member contains a parent material and filler particles unevenly distributed in a surface side of the sealing member and has a surface which has an irregular geometry formed associated with the filler particles.

First claim

What is claimed is:

1. A light emitting device comprising:
a base substrate;
a light emitting element provided on the base substrate; and
a sealing member to seal the light emitting element, the sealing member containing a parent material and filler particles unevenly distributed in a surface side of the sealing member and having a surface which has an irregular geometry formed associated with the filler particles, the sealing member being a single layer,
wherein the filler particles are porous or hollow,
wherein the base substrate is a package having a recess and lead electrodes disposed on a bottom surface of the recess,
wherein the sealing member is provided substantially only in the recess,
wherein the filler particles are made of at least one material selected from a group of silica, titanium oxide, calcium carbonate, calcium silicate, ferric oxide, carbon black, zinc oxide, barium titanate, and aluminum oxide,
wherein the parent material of the sealing member is one selected from a group of an epoxy resin and a modified epoxy resin,
wherein the parent material of the sealing member and the filler particles have a difference in refractive index of 0.1 or smaller, and
wherein the sealing member comprises second filler particles made of silica unevenly distributed in the bottom surface side of the recess.

2. The light emitting device according to claim 1 , wherein the surface of the sealing member is a concave surface which dents from a peripheral portion of the sealing member toward a center portion of the sealing member, and the filler particles are unevenly distributed in the peripheral portion of the sealing member.

3. The light emitting device according to claim 1 , wherein the parent material of the sealing member covers the filler particles.

4. The light emitting device according to claim 1 , wherein the filler particles are substantially localized in a portion in a vicinity of the surface of the sealing member.

5. The light emitting device according to claim 1 , wherein the filler particles are porous particles.

6. The light emitting device according to claim 1 , wherein the parent material of the sealing member is an epoxy resin curing with a cationic curing agent.

7. The light emitting device according to claim 1 , wherein the parent material of the sealing member is a silicone resin of an addition polymerization type.

8. The light emitting device according to claim 1 , wherein particle size of the filler particles is 1 μm or more and 35 μm or less.

9. The light emitting device according to claim 1 , wherein the specific gravity of the filler particles is 0.4 or more and 0.8 or less.

10. The light emitting device according to claim 1 , wherein the filler particles are made of silica.

11. The light emitting device according to claim 1 , wherein the filler particles have a crushed shape.

12. The light emitting device according to claim 1 , wherein the filler particles have a spherical shape.

13. The light emitting device according to claim 1 , wherein the filler particles are exposed from a parent material of the sealing member so that the irregular geometry of the surface of the sealing member is formed with a surface of the parent material of the sealing member and the surfaces of the filler particles.

14. The light emitting device according to claim 1 , wherein the light emitting element is capable of emitting red light, further comprising a light emitting element capable of emitting green light and a light emitting element capable of emitting blue light.

15. The light emitting device according to claim 1 , wherein the filler particles are hollow.

16. The light emitting device according to claim 1 , wherein the filler particles have an irregular shape.

17. The light emitting device according to claim 1 , wherein the second filler particles are nonporous.

18. The light emitting device according to claim 1 ,
wherein the filler particles are provided within a first region of the sealing member in the surface side of the sealing member,
wherein the second filler particles are provided within a second region of the sealing member on the bottom surface side, and
wherein the sealing member includes a third region that is provided between the first region and the second region, the third region being substantially entirely formed of the parent material without the filler particles or the second filler particles provided therein.

19. The light emitting device according to claim 1 , wherein at least a part of an upper surface of the package is black.

20. A light emitting device comprising:
a base substrate having a recess;
a light emitting element provided on a bottom surface of the recess; and
a sealing member provided in the recess to seal the light emitting element,
wherein the sealing member containing first filler particles unevenly distributed in an upper surface side of the sealing member and having a surface which has an irregular geometry formed associated with the first filler particles, the sealing member being a single layer, and
wherein the sealing member comprises second filler particles made of silica unevenly distributed in a bottom surface side of the recess.

Assignees

• Sato Masanobu
• Nichia Corp

Inventors

• Sato Masanobu

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10H20/854 Primary

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/8506

  Containers · CPC title