Area array device connection structures with complimentary warp characteristics

Patent metadata

Field	Value
Publication number	US-9609744-B2
Application number	US-201514666387-A
Country	US
Kind code	B2
Filing date	Mar 24, 2015
Priority date	Mar 12, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Printed circuit boards (PCBs) can be designed to have dynamic warp characteristics complimentary to those of an attached component. A PCB and an attached component can be designed to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp. Warp characteristics of the PCB and the attached component can be determined by the vertical thickness of conductor and dielectric layers, by the wiring density and number of conductor layers. Warp characteristics can also be at least partially determined by the arrangement/ordering of conductor and dielectric layers, by dimensions of a sash structure surrounding a component outline and by dimensions of a prepreg layer applied to an existing design. Such a prepreg layer can cover a portion or an entirety of one of the PCBs planar surfaces.

First claim

What is claimed is:

1. An electrical assembly comprising a printed circuit board (PCB) and an attached component, the PCB and the attached component configured to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp, the dynamic warp characteristics of at least one of the PCB and the attached component at least partially determined by electrical assembly characteristics including a vertical thickness of a conductor layer, a number of conductor layers, a vertical thickness of a dielectric layer and an arrangement of conductor and dielectric layers.

2. The electrical assembly of claim 1 , further comprising a second attached component wherein, during the thermal excursion, the PCB and the second attached component dynamically warp in a same direction, with approximately a same magnitude of warp.

3. The electrical assembly of claim 1 , wherein dynamic warp characteristics of at least one of the PCB and the attached component are at least partially determined by a wiring density of a conductor layer.

4. The electrical assembly of claim 1 , wherein dynamic warp characteristics of at least one of the PCB and the attached component are at least partially determined by dimensions of a sash structure surrounding a component outline on an outer layer of the PCB.

5. The electrical assembly of claim 1 , wherein dynamic warp characteristics of at least one of the PCB and the attached component are at least partially determined by dimensions of a prepreg layer applied to an existing design, the prepreg layer including a reinforcing fabric pre-impregnated with a resin compound, the prepreg layer covering an entirety of one the PCB's planar surfaces.

6. The electrical assembly of claim 1 , wherein dynamic warp characteristics of at least one of the PCB and the attached component are at least partially determined by dimensions of a prepreg layer applied to an existing design, the prepreg layer including a reinforcing fabric pre-impregnated with a resin compound, the prepreg layer covering a portion of one the PCB's planar surfaces.

7. The electrical assembly of claim 1 , wherein dynamic warp characteristics of at least one of the PCB and the attached component are at least partially determined by constituent materials with physical properties suitable for at least partially determining the dynamic warp characteristics of at least one of the PCB and the attached component.

8. The electrical assembly of claim 7 , wherein a constituent material's physical property suitable for modifying warp characteristics is a coefficient of thermal expansion (CTE) of the constituent material.

9. The electrical assembly of claim 7 , wherein a constituent material with physical properties suitable for modifying the warp characteristics of at least one of the PCB and the attached component is one of a prepreg material, an epoxy material and a conductor material.

10. The electrical assembly of claim 1 , further comprising component attachment structures, to attach the component to the PCB, the component attachment structures including two opposing substantially planar surfaces with a set of contact points on each surface arranged to be electrically connected with contact devices.

11. The electrical assembly of claim 10 , wherein types of contact devices include at least one of solder balls, solder columns, elastomeric contacts and mechanical contacts.

12. The electrical assembly of claim 1 , wherein thermally induced dynamic warp is the warp of at least one of the PCB and the attached component resulting from temperature excursions experienced by at least one of the PCB and the attached component in a solder reflow process.

13. The electrical assembly of claim 12 , wherein the temperature excursions are provided by a reflow oven used in a reflow process intended to create electrical contacts between a component and PCB by melting solder placed between opposing electrical attach points on the component and the PCB.

14. The electrical assembly of claim 13 , wherein the temperature excursions are provided by a reflow oven include both a heating and a cooling cycle.

Assignees

• IBM

Inventors

• Hoffmeyer Mark K
• Mikhail Amanda E
• Sinha Arvind K

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• G06F30/39 Primary

  Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) · CPC title

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K2201/09136

  Means for correcting warpage · CPC title

• G06F30/333

  Design for testability [DFT], e.g. scan chain or built-in self-test [BIST] · CPC title