Electrochemical deposition method

Patent metadata

Field	Value
Publication number	US-9624596-B2
Application number	US-201615180457-A
Country	US
Kind code	B2
Filing date	Jun 13, 2016
Priority date	Jul 22, 2002
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

First claim

The invention claimed is:

1. A substrate holder for holding a substrate having a surface to be electroplated, said substrate holder comprising:
a fixed holding member;
a movable holding member, the fixed holding member and the movable holding member being arranged and configured for holding the substrate therebetween, the movable holding member having a sealing member; and
at least one pair of conductors for detecting a liquid leak, the at least one pair of conductors extending along an entire circumference of the sealing member and being located inside the sealing member spaced a distance from the substrate while the substrate is held between the movable holding member and the fixed holding member, the at least one pair of conductors having open first ends and having second ends to be connected to an electric resistance measuring device, the at least one pair of conductors being configured to short-circuit via a leaked plating solution when a plating solution leaks to a back side of the substrate held between the movable holding member and the fixed holding member.

2. An electroplating apparatus comprising:
a substrate holder according to claim 1 .

3. The substrate holder according to claim 1 , wherein the at least one pair of conductors comprises only one pair of conductors.

4. The substrate holder according to claim 1 , further comprising electrical contacts located outside the sealing member and configured to contact the surface to be electroplated of the substrate while the substrate is held between the movable holding member and the fixed holding member.

5. The substrate holder according to claim 1 , wherein the at least one pair of conductors are located at the back side of the substrate.

6. The substrate holder according to claim 1 , wherein the at least one pair of conductors extend continuously in a circumferential direction of the sealing member.

Assignees

• Ebara Corp

Inventors

• Yoshioka Junichiro
• Horie Kuniaki
• Guo Yugang
• Morikami Satoshi

Classifications

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title