Film cutting apparatus

Patent metadata

Field	Value
Publication number	US-11027451-B2
Application number	US-201916445916-A
Country	US
Kind code	B2
Filing date	Jun 19, 2019
Priority date	Nov 28, 2018
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

A film cutting apparatus includes: a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface; a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a film is provided; a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a film is provided; at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate; a first elastic member between the first die plate and the punch plate; a second elastic member between the punch plate and the second die plate; and an elevator configured to press the first die plate.

First claim

What is claimed is:

1. A film cutting apparatus comprising:
a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface;
a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate;
a first elastic member between the first die plate and the punch plate;
a second elastic member between the punch plate and the second die plate; and
an elevator configured to press the first die plate,
wherein a length of the first elastic member is greater than that of the second elastic member.

2. The film cutting apparatus of claim 1 , wherein the first punch and the second punch correspond to each other.

3. The film cutting apparatus of claim 1 , wherein each of the first die plate, the punch plate, and the second die plate has through holes, and the at least two guide bars are inserted through corresponding ones of the through holes.

4. The film cutting apparatus of claim 1 , wherein the first elastic member and the second elastic member are provided so that the at least two guide bars penetrate an inside thereof.

5. The film cutting apparatus of claim 1 , wherein each surface of the first and second die plates on which a corresponding one of the first and second films is provided includes a guide groove into which a corresponding one of the first and second films is inserted.

6. A film cutting apparatus comprising:
a first punch plate including a first punch protruded on an upper surface;
a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
a second punch plate below the first punch plate and having a second punch protruded on a lower surface;
a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
at least two guide bars penetrating the first die plate, the first punch plate and the second punch plate and fixed to the second die plate;
a first elastic member between the first die plate and the first punch plate;
a second elastic member between the second punch plate and the second die plate; and
an elevator configured to press the first die plate,
wherein a length of the first elastic member is greater than that of the second elastic member.

7. The film cutting apparatus of claim 6 , wherein the first punch and the second punch correspond to each other.

8. The film cutting apparatus claim 6 , wherein each of the first die plate, the first punch plate, the second punch plate, and the second die plate has through holes, and the at least two guide bars are inserted through the through holes.

9. The film cutting apparatus of claim 6 , wherein the first elastic member and the second elastic member are provided so that the at least two guide bars penetrate an inside thereof.

10. The film cutting apparatus of claim 6 , wherein each surface of the first and second die plates on which a corresponding one of the first and second films is provided includes a guide groove into which a corresponding one of the first and second films is inserted.

11. A film cutting apparatus comprising:
a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface;
a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate;
a first elastic member between the first die plate and the punch plate;
a second elastic member between the punch plate and the second die plate; and
an elevator configured to press the first die plate,
wherein an elastic modulus of the first elastic member is larger than that of the second elastic member.

Assignees

• Samsung Display Co Ltd

Inventors

• Song Jae Suk

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/7444

  using a peeling wedge, a knife or a bar · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B26F1/44 Primary

  Cutters therefor; Dies therefor · CPC title

• B26F1/40

  using a press, e.g. of the ram type (presses in general B30B) · CPC title