High performance inductors

US11024454B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11024454-B2
Application numberUS-201615191203-A
CountryUS
Kind codeB2
Filing dateJun 23, 2016
Priority dateOct 16, 2015
Publication dateJun 1, 2021
Grant dateJun 1, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is an inductor device including a first curved metal plate, a second curved metal plate below and substantially vertically aligned with the first curved metal plate, and a first elongated via vertically aligned between the first curved metal plate and the second curved metal plate, the first elongated via configured to conductively couple the first curved metal plate to the second curved metal plate and having an aspect ratio of a width to a height of the first elongated via of at least approximately 2 to 1.

First claim

Opening claim text (preview).

What is claimed is: 1. An inductor device, comprising: a first curved metal plate; a second curved metal plate below and substantially vertically aligned with the first curved metal plate, wherein the second curved metal plate is substantially vertically aligned with the first curved metal plate for an entire length of the second curved metal plate except a terminal end of the second curved metal plate; a first elongated via vertically aligned between the first curved metal plate and the second curved metal plate, the first elongated via configured to conductively couple the first curved metal plate to the second curved metal plate and having an aspect ratio of a width to a height of the first elongated via of at least approximately 2 to 1; a third curved metal plate below and substantially vertically aligned with the second curved metal plate; and a second elongated via vertically aligned between the second curved metal plate and the third curved metal plate, the second elongated via configured to conductively couple the second curved metal plate to the third curved metal plate and having an aspect ratio of a width to a height of at least approximately 2 to 1, wherein the inductor device has no more curved metal plates than the first curved metal plate, the second curved metal plate, and the third curved metal plate, wherein each of the first curved metal plate, the second curved metal plate, and the third curved metal plate consists of a top metal layer and a bottom metal layer connected by a middle metal layer, wherein the bottom metal layer of the first curved metal plate forms a first terminal end of the inductor device and the bottom metal layer of the third curved metal plate forms a second terminal end of the inductor device, and wherein the inductor device has no more terminal ends than the first terminal end and the second terminal end. 2. The inductor device of claim 1 , wherein the first elongated via is completely within a vertical perimeter defined by an inside edge and an outside edge of the first curved metal plate. 3. The inductor device of claim 1 , wherein the first curved metal plate and the second curved metal plate are octagon shaped. 4. The inductor device of claim 1 , wherein the inductor device comprises one of a radio frequency (RF) front end module, a filter, or a power amplifier (PA). 5. The inductor device of claim 1 , further comprising a coreless substrate between the first curved metal plate and the second curved metal plate. 6. The inductor device of claim 1 , wherein the first curved metal plate and the second curved metal plate have approximately a same length. 7. The inductor device of claim 1 , wherein the inductor device is incorporated into a device selected from a group comprising a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an automotive device in an automotive vehicle, an RF front end module, a filter, or a PA. 8. The inductor device of claim 1 , wherein each of the first elongated via and the second elongated via has squared ends. 9. The inductor device of claim 1 , wherein the first elongated via and the second elongated via are approximately a same length. 10. An inductor device, comprising: a first conductive means; a second conductive means below and substantially vertically aligned with the first conductive means, wherein the second conductive means is substantially vertically aligned with the first conductive means for an entire length of the second conductive means except a terminal end of the second conductive means; a first elongated via vertically aligned between the first conductive means and the second conductive means, the first elongated via configured to conductively couple the first conductive means to the second conductive means and having an aspect ratio of a width to a height of the first elongated via of at least approximately 2 to 1; a third conductive means below and substantially vertically aligned with the second conductive means; and a second elongated via vertically aligned between the second conductive means and the third conductive means, the second elongated via configured to conductively couple the second conductive means to the third conductive means and having an aspect ratio of a width to a height of at least approximately 2 to 1, wherein the inductor device has no more conductive means than the first conductive means, the second conductive means, and the third conductive means, wherein each of the first conductive means, the second conductive means, and the third conductive means consists of a top metal layer and a bottom metal layer connected by a middle metal layer, wherein the bottom metal layer of the first conductive means forms a first terminal end of the inductor device and the bottom metal layer of the third conductive means forms a second terminal end of the inductor device, and wherein the inductor device has no more terminal ends than the first terminal end and the second terminal end. 11. The inductor device of claim 10 , wherein the first elongated via is completely within a vertical perimeter defined by an inside edge and an outside edge of the first conductive means. 12. The inductor device of claim 10 , wherein the inductor device comprises one of a radio frequency (RF) front end module, a filter, or a power amplifier (PA). 13. The inductor device of claim 10 , further comprising a coreless substrate between the first conductive means and the second conductive means. 14. The inductor device of claim 10 , wherein the first conductive means and the second conductive means have approximately a same length. 15. The inductor device of claim 10 , wherein the inductor device is incorporated into a device selected from a group comprising a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an automotive device in an automotive vehicle, an RF front end module, a filter, or a PA.

Assignees

Inventors

Classifications

  • with stacked layers · CPC title

  • Details of via holes for interconnecting the layers · CPC title

  • Amplifiers using galvano-magnetic effects not involving mechanical movement, e.g. using Hall effect · CPC title

  • Sheets; Strips (H01F27/2866 takes precedence) · CPC title

  • Electrical filters or coupling circuits · CPC title

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What does patent US11024454B2 cover?
Disclosed is an inductor device including a first curved metal plate, a second curved metal plate below and substantially vertically aligned with the first curved metal plate, and a first elongated via vertically aligned between the first curved metal plate and the second curved metal plate, the first elongated via configured to conductively couple the first curved metal plate to the second cur…
Who is the assignee on this patent?
Qualcomm Inc
What technology area does this patent fall under?
Primary CPC classification H01F17/0013. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).