Chip electronic component and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9976224-B2
Application number	US-201414284236-A
Country	US
Kind code	B2
Filing date	May 21, 2014
Priority date	Dec 18, 2013
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

First claim

What is claimed is:

1. A chip electronic component comprising:
a magnetic body including an insulation substrate;
an internal coil part disposed on at least one surface of the insulation substrate; and
an external electrode disposed on an end surface of the magnetic body and connected to the internal coil part,
wherein the internal coil part includes
a first coil pattern disposed on the insulation substrate and
a second coil pattern disposed on the first coil pattern as a coating layer to coat an upper surface and side surfaces of the first coil pattern,

a ratio a/b is less than 1 and a ratio a/b is less than a ratio a′/b′ where a represents a width of an upper surface of the first coil pattern, b represents a width of a lower surface of the first coil pattern, a′ represents a width of an upper surface of the internal coil part, and b′ represents a width of a lower surface of the internal coil part, and
the second coil pattern is a plating layer disposed to coat the first coil pattern.

2. The chip electronic component of claim 1 , wherein the ratio a/b of the width a of the upper surface of the first coil pattern with respect to the width b of the lower surface thereof satisfies 0.5≤a/b<1.

3. The chip electronic component of claim 1 , wherein a cross-section of the first coil pattern may have a thickness direction trapezoidal shape of which a length of a lower surface is greater than that of an upper surface.

4. The chip electronic component of claim 1 , wherein the width b of the lower surface of the first coil pattern is 90 μm to 110 μm.

5. The chip electronic component of claim 1 , wherein the width a of the upper surface of the first coil pattern is 70 μm to 90 μm.

6. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern.

7. The chip electronic component of claim 1 , wherein a ratio a′/b′ of a width a′ of an upper surface of the internal coil part with respect to a width b′ of a lower surface thereof is less than 1.

8. The chip electronic component of claim 1 , wherein the internal coil part contains one or more selected from a group consisting of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), and platinum (Pt).

9. The chip electronic component of claim 1 , wherein the first coil pattern and the second coil pattern are formed of a single type of metal.

10. The chip electronic component of claim 1 , wherein the internal coil part has an aspect ratio of 1.1 or more.

11. The chip electronic component of claim 1 , wherein the first coil pattern is a seed layer of the plating layer of the second coil pattern.

12. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern and formed of a same type of metal as the second coil pattern.

13. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern, and the first, second, and third coil patterns are formed of a single type of metal.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Dong Jin
• Kim Sung Hoon
• Min Byung Seung

Classifications

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• C25D7/001 Primary

  Magnets · CPC title