Method of lower profile mems package with stress isolations
US-2016340175-A1 · Nov 24, 2016 · US
Bonding of two components
Bonding of two components · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C3/001 |
| Official title | {Bonding of two components} |
| Display label | Bonding of two components |
| Total patents | 564 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 44 |
| 2016 | 41 |
| 2017 | 58 |
| 2018 | 61 |
| 2019 | 70 |
| 2020 | 66 |
| 2021 | 56 |
| 2022 | 48 |
| 2023 | 36 |
| 2024 | 47 |
| 2025 | 29 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Encapsulated component comprising a MEMS component and method for the production thereof
US-9481565-B2 · Nov 1, 2016 · US
Fluidic module permanent stack assemblies and methods
US-9446378-B2 · Sep 20, 2016 · US
Chip package and fabrication method thereof
US-2016229687-A1 · Aug 11, 2016 · US
Wafer to Wafer Bonding Process and Structures
US-2016190089-A1 · Jun 30, 2016 · US
Method for fabricating thermoplastic fluidic devices by orogenic growth and fluidic devices manufactured thereby
US-9376311-B2 · Jun 28, 2016 · US
Method of lower profile mems package with stress isolations
US-2016167949-A1 · Jun 16, 2016 · US
Mechanisms for forming micro-electro mechanical system device
US-9352953-B2 · May 31, 2016 · US
Method and applications of thin-film membrane transfer
US-9352959-B1 · May 31, 2016 · US
Method of bonding two surfaces and construct therefrom and microfluidic device containing the construct
US-2016121327-A1 · May 5, 2016 · US
Microfluid delivery device and method for manufacturing the same
US-2016121612-A1 · May 5, 2016 · US
Method for producing a substrate holder
US-9321636-B2 · Apr 26, 2016 · US
Method for producing a microfluidic device
US-9266280-B2 · Feb 23, 2016 · US
Micromirror array assembly
US-9261696-B2 · Feb 16, 2016 · US
Mems device and process for rf and low resistance applications
US-2016031702-A1 · Feb 4, 2016 · US
Soi substrate, physical quantity sensor, soi substrate manufacturing method, and physical quantity sensor manufacturing method
US-2016016788-A1 · Jan 21, 2016 · US
Micromechanical sensor device
US-2015375990-A1 · Dec 31, 2015 · US
Method for fabricating thermoplastic fluidic devices by orogenic growth and fluidic devices manufactured thereby
US-2015368098-A1 · Dec 24, 2015 · US
Vhf etch barrier for semiconductor integrated microsystem
US-2015364363-A1 · Dec 17, 2015 · US
Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type
US-2015353349-A1 · Dec 10, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C3/001?
- CPC B81C3/001 is the Cooperative Patent Classification code for “Bonding of two components.”
- How many patents are filed under CPC B81C3/001 (Bonding of two components)?
- Our database includes 564 publications tagged with this CPC code.
- Is patent activity under CPC B81C3/001 growing?
- Publication counts under this code: 47 in 2024 vs 29 in 2025 (latest complete years).