Sensor package and method of producing the sensor package
US-2019375628-A1 · Dec 12, 2019 · US
Gluing
Gluing · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C2203/032 |
| Official title | Gluing |
| Display label | Gluing |
| Total patents | 229 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 8 |
| 2017 | 8 |
| 2018 | 25 |
| 2019 | 29 |
| 2020 | 22 |
| 2021 | 37 |
| 2022 | 17 |
| 2023 | 25 |
| 2024 | 21 |
| 2025 | 18 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for producing fine structures in the volume of a substrate composed of hard brittle material
US-2019329251-A1 · Oct 31, 2019 · US
Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
US-2019330056-A1 · Oct 31, 2019 · US
Mounting structures for integrated device packages
US-2019319011-A1 · Oct 17, 2019 · US
Die stack arrangement and method for producing same
US-2019304945-A1 · Oct 3, 2019 · US
Method for forming film and method for manufacturing inkjet print head
US-10343403-B2 · Jul 9, 2019 · US
Fence structure to prevent stiction in a mems motion sensor
US-2019062153-A1 · Feb 28, 2019 · US
Pressure sensors and method for forming a mems pressure sensor
US-2018335359-A1 · Nov 22, 2018 · US
Microelectromechanical system with spring for magnet placement
US-10125013-B2 · Nov 13, 2018 · US
Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus
US-10112376-B2 · Oct 30, 2018 · US
Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
US-2018281414-A1 · Oct 4, 2018 · US
Semiconductor device package and method of manufacturing the same
US-2018265347-A1 · Sep 20, 2018 · US
Micro normally-closed structure and method for manufacturing the same
US-10077185-B2 · Sep 18, 2018 · US
Membrane bonding with photoresist
US-10065854-B2 · Sep 4, 2018 · US
Method of assembling nanoscale and microscale objects into three-dimensional structures
US-2018244518-A1 · Aug 30, 2018 · US
Micromechanical system including a sensitive element and associated manufacturing method
US-2018237290-A1 · Aug 23, 2018 · US
Membrane bonding with photoresist
US-2018179053-A1 · Jun 28, 2018 · US
Micro-electro-mechanical device with a movable structure, in particular micromirror, and manufacturing process thereof
US-2018180871-A1 · Jun 28, 2018 · US
Method of manufacturing pattern substrate and method of locating component
US-10005663-B2 · Jun 26, 2018 · US
Method for Transferring and Placing a Semiconductor Device on a Substrate
US-2018166416-A1 · Jun 14, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C2203/032?
- CPC B81C2203/032 is the Cooperative Patent Classification code for “Gluing.”
- How many patents are filed under CPC B81C2203/032 (Gluing)?
- Our database includes 229 publications tagged with this CPC code.
- Is patent activity under CPC B81C2203/032 growing?
- Publication counts under this code: 21 in 2024 vs 18 in 2025 (latest complete years).