Chip resistor and mounting structure thereof

Patent metadata

Field	Value
Publication number	US-11017922-B2
Application number	US-202016780431-A
Country	US
Kind code	B2
Filing date	Feb 3, 2020
Priority date	Jun 13, 2013
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

First claim

The invention claimed is:

1. A chip resistor comprising:
an insulating substrate;
a resistive member supported by the insulating substrate;
an insulating layer having a first surface and a second surface opposite to the first surface, at least a part of the first surface being in direct contact with the resistive member;
a conductive layer held in direct contact with the second surface of the insulating layer and the resistive member; and
an electrode held in direct contact with the conductive layer,
wherein the insulating substrate and the resistive member comprise respective side faces flush with each other,
an entirety of the insulating layer is spaced apart from the side faces flush with each other in a longitudinal direction of the insulating substrate,
the electrode comprises a Sn plated layer and a Cu plated layer, the Sn plated layer being in direct contact with the side face of the insulating substrate, the Cu plated layer being in direct contact with the side face of the resistive member.

2. The chip resistor according to claim 1 , wherein the resistive member comprises a first surface and a second surface opposite to the first surface of the resistive member, the second surface of the resistive member facing the insulating layer, wherein the side face of the resistive member connects the first surface of the resistive member and the second surface of the resistive member to each other.

3. The chip resistor according to claim 1 , wherein the electrode is in direct contact with the insulating substrate.

4. The chip resistor according to claim 1 , wherein the insulating substrate contains a glass material.

5. The chip resistor according to claim 1 , wherein the resistive member comprises a first end portion and a second end portion that are spaced apart from each other in the longitudinal direction of the insulating substrate, the first end portion being exposed from the insulating layer.

6. The chip resistor according to claim 1 , wherein at least a part of the resistive member is embedded in the insulating substrate.

7. The chip resistor according to claim 1 , wherein the resistive member is greater in size measured in the longitudinal direction of the insulating substrate than the insulating layer.

8. The chip resistor according to claim 1 , wherein the insulating substrate is equal to the resistive member in size measured in the longitudinal direction of the insulating substrate.

9. The chip resistor according to claim 1 , wherein the second surface of the insulating layer comprises an exposed region exposed from the conductive layer, and the electrode is in direct contact with a part of the exposed region.

10. The chip resistor according to claim 9 , wherein another part of the exposed region is exposed to outside of the chip resistor.

11. The chip resistor according to claim 1 , wherein the Cu plated layer is held in direct contact with the conductive layer.

12. The chip resistor according to claim 11 , wherein the conductive layer contains one of Ni or Cr.

13. The chip resistor according to claim 11 , wherein the conductive layer is smaller in thickness than the Cu plated layer.

14. The chip resistor according to claim 1 , wherein the conductive layer comprises: a first portion held in direct contact with the second surface of the insulating layer; a second portion held in direct contact with the resistive member; and a connecting portion that connects the first portion and the second portion to each other.

15. The chip resistor according to claim 1 , wherein the electrode comprises a Ni plated layer disposed between the Sn plated layer and the Cu plated layer.

16. The chip resistor according to claim 1 , wherein the insulating layer is made of a resin material.

17. The chip resistor according to claim 1 , wherein the insulating substrate comprises a glass containing member having a form of plate,
the resistive member is disposed between the glass containing member and the insulating layer, and
the insulating layer is greater in heat conductance than the insulating substrate.

18. A chip resistor comprising:
an insulating substrate;
a resistive member supported by the insulating substrate;
an insulating layer having a first surface and a second surface opposite to the first surface, at least a part of the first surface being in direct contact with the resistive member;
an conductive layer held in direct contact with the second surface of the insulating layer and the resistive member; and
an electrode held in direct contact with the conductive layer,
wherein the electrode comprises a Sn plated layer and a Cu plated layer, the Sn plated layer being in direct contact with a side face of the insulating substrate, the Cu plated layer being in direct contact with a side face of the resistive member.

19. The chip resistor according to claim 18 , wherein the electrode comprises a Ni plated layer disposed between the Sn plated layer and the Cu plated layer.

20. The chip resistor according to claim 18 , wherein the side face of the insulating substrate is flush with the side face of the resistive member.

Assignees

• Rohm Co Ltd

Inventors

• Yoneda Masaki

Classifications

• H01C1/028 Primary

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C3/12

  lying in one plane · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title