Process chamber for field guided exposure and method for implementing the process chamber

US11003080B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11003080-B2
Application numberUS-201816138142-A
CountryUS
Kind codeB2
Filing dateSep 21, 2018
Priority dateNov 14, 2014
Publication dateMay 11, 2021
Grant dateMay 11, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the substrate support, and a plurality of electrodes connecting the top plate to the bottom plate. A voltage is applied to the plurality of electrodes to generate an electric field. Methods for exposing a photoresist layer on a substrate to an electric field are also disclosed herein.

First claim

Opening claim text (preview).

What is claimed is: 1. A processing chamber comprising: a chamber body; a substrate support disposed in the chamber body; and an electrode assembly, the electrode assembly comprising: a top plate disposed above the substrate support; a bottom plate disposed below the substrate support; and a plurality of electrodes connecting the top plate to the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field, wherein the plurality of electrodes are displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate. 2. The processing chamber of claim 1 , wherein the electrode assembly is configured to couple to a power source. 3. The processing chamber of claim 1 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening. 4. The processing chamber of claim 1 , wherein the plurality of electrodes is in a cylindrical arrangement and at least one electrode of the plurality of electrodes is operable to move through the bottom plate. 5. The processing chamber of claim 1 , wherein the plurality of electrodes are disposed inside the chamber body. 6. The processing chamber of claim 1 , wherein the substrate support is rotatable. 7. The processing chamber of claim 1 , further configured to independently control voltage provided to each of the electrodes. 8. The processing chamber of claim 7 , further configured to independently control voltage provided to a first electrode of the plurality of electrodes based on an angular orientation of the first electrode. 9. A processing chamber comprising: a chamber body; a substrate support disposed in the chamber body; and an electrode assembly disposed in a processing volume defined by the chamber body, the electrode assembly comprising: a top plate disposed above the substrate support; a bottom plate disposed below the substrate support; and a plurality of electrodes connecting the top plate to the bottom plate, each electrode in the plurality of electrodes having a first end and a second end, the first end contacting the top plate and the second end contacting the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field directly above and parallel to the substrate support, wherein the plurality of electrodes are displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate. 10. The processing chamber of claim 9 , wherein the electrode assembly is configured to couple to a power source. 11. The processing chamber of claim 9 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening. 12. The processing chamber of claim 9 , wherein the plurality of electrodes is in a cylindrical arrangement and is movable between a position where the second end of a first electrode of the plurality of electrodes contacts the bottom plate and a position where the second end of the first electrode is spaced from the bottom plate. 13. The processing chamber of claim 9 , wherein the substrate support is rotatable. 14. The processing chamber of claim 9 , further configured to independently control voltage provided to each of the electrodes. 15. The processing chamber of claim 14 , further configured to independently control voltage provided to a first electrode of the plurality of electrodes based on an angular orientation of the first electrode. 16. A processing chamber comprising: a chamber body; a substrate support disposed in the chamber body; and an electrode assembly, the electrode assembly comprising: a top plate disposed above the substrate support; a bottom plate disposed below the substrate support; and a plurality of electrodes connecting the top plate to the bottom plate, the electrodes operable, upon application of a voltage thereto, to generate an electric field, the plurality of electrodes comprising at least one stationary electrode and at least one opening electrode, wherein the at least one opening electrode of the plurality of electrodes is displaced vertically to electrically connect and disconnect the top plate to the bottom plate and are configured to split and move vertically to electrically connect and disconnect the top plate to the bottom plate. 17. The process chamber of claim 16 , wherein the bottom plate further comprises an opening therethough, wherein a portion of the substrate support is disposed through the opening. 18. The process chamber of claim 16 , wherein the at least one opening electrode comprises a top opening electrode configured to extend at least partially outside the processing chamber. 19. The process chamber of claim 18 , wherein the top opening electrode is coupled to an actuator. 20. The process chamber of claim 16 , wherein the at least one opening electrode comprises a bottom opening electrode configured to extend at least partially outside the processing chamber.

Assignees

Inventors

Classifications

  • Shape · CPC title

  • Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

  • G03F7/20Primary

    Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

  • Electrodes, e.g. special shape, material or configuration · CPC title

  • Arrangements to provide capillary discharges · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11003080B2 cover?
A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the subs…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification G03F7/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).