Controlling photo acid diffusion in lithography processes

Patent metadata

Field	Value
Publication number	US-9798240-B2
Application number	US-201414472306-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Jul 10, 2014
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field, a magnetic field, and/or a standing wave during photolithography processes. The field and/or standing wave application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.

First claim

What is claimed is:

1. An apparatus for processing a substrate, the apparatus comprising:
a substrate support, the substrate support comprising a surface configured to support a substrate thereon;
a heat source, the heat source configured to heat a substrate positioned on the surface of the substrate support; and
an electrode assembly positioned proximate to the surface of the substrate support, the electrode assembly comprising a plurality of individually addressable electrodes, each individually addressable electrode comprising one or more antennas, wherein the electrode assembly is configured to generate an electric field in a direction substantially parallel to the surface of the substrate support.

2. The apparatus of claim 1 , wherein the plurality of individually addressable electrodes comprises about 8 to about 80 individually addressable electrodes.

3. The apparatus of claim 1 , wherein the electrode assembly is on the surface of the substrate support.

4. The apparatus of claim 1 , wherein the electrode assembly is integrated with the substrate support.

5. The apparatus of claim 1 , wherein the antennas associated with the plurality of individually addressable electrodes are substantially parallel to each other.

6. The apparatus of claim 5 , wherein the distance between each adjacent antenna included in the plurality of individually addressable electrodes is substantially the same.

7. The apparatus of claim 6 , wherein the substrate support and electrode assembly are positioned within a vacuum chamber.

8. The apparatus of claim 1 , further comprising:
a cavity positioned proximate to the surface of the substrate support; and
at least one generator proximate to the cavity and configured to generate a standing wave within the cavity.

9. The apparatus of claim 8 , wherein the at least one generator is configured to generate a frequency of less than about 6 GHz.

10. The apparatus of claim 8 , wherein the at least one generator is configured to generate a standing wave having a period of about 100 nanometers to about 500 nanometers.

11. The apparatus of claim 8 , wherein the at least one generator comprises at least one of a microwave generator and a long-wavelength laser.

12. An apparatus for processing a substrate, the apparatus comprising:
a substrate support, the substrate support comprising a surface configured to support a substrate thereon;
a heat source, the heat source configured to heat a substrate positioned on the surface of the substrate support;
an electrode assembly positioned proximate to the surface of the substrate support, the electrode assembly comprising a plurality of individually addressable electrodes, each individually addressable electrode comprising one or more antennas, wherein the electrode assembly is configured to generate an electric field in a direction substantially parallel to the surface of the substrate support, and wherein the electrode assembly is integrated with the substrate support;
a cavity positioned proximate to the surface of the substrate support; and
at least one generator proximate to the cavity and configured to generate a standing wave within the cavity.

Assignees

• Applied Materials Inc

Inventors

• Xie Peng
• Godet Ludovic
• Bencher Christopher

Classifications

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/38 Primary

  Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title