Automatic registration between circuit dies and interconnects

Patent metadata

Field	Value
Publication number	US-10971468-B2
Application number	US-201716461015-A
Country	US
Kind code	B2
Filing date	Nov 16, 2017
Priority date	Nov 21, 2016
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

First claim

What is claimed is:

1. An article comprising:
a substrate having a major surface, wherein a pocket and one or more channels are formed on the major surface, and the channels each extend between a first end and a second end thereof, the first end being fluidly connected to the pocket;
a solid circuit die disposed in the pocket, the solid circuit die having one or more contact pads on a surface thereof aligned with the first ends of the channels; and
one or more electrically conductive traces formed in the one or more channels, the electrically conductive traces extending to the first ends of the channels and in direct contact with the contact pads of the solid circuit die,
wherein the one or more electrically conductive traces are layered on a curved meniscus surface of an adhesive layer disposed in the one or more channels.

2. The article of claim 1 , wherein the substrate further comprises one or more reservoirs formed on the major surface thereof and connected to the second ends of the channels, the electrically conductive traces have a portion in the reservoirs and extend between the first and second ends of the channels.

3. The article of claim 1 , wherein the solid circuit die is attached, via an adhesive, to a bottom surface of the pocket.

4. The article of claim 1 , wherein at least one of the electrically conductive traces is in direct contact with one contact pad on a side surface of the solid circuit die.

5. The article of claim 1 , wherein at least one of the conductive traces extends onto an edge of an upper surface of the solid circuit die, and is in direct contact with an edge portion of one contact pad on the upper surface of the solid circuit die.

6. The article of claim 1 , wherein the electrically conductive traces are formed by solidifying a conductive liquid.

7. The article of claim 1 , wherein the solid circuit die and the pocket have a gap formed therebetween, the gap surrounding the periphery of the solid circuit die.

8. The article of claim 7 , wherein the gap is at least partially filled with an adhesive material.

9. The article of claim 7 , wherein a sealing structure is provided to separate the gap from the one or more channels.

10. The article of claim 1 , wherein the one or more electrically conductive traces have a curved meniscus surface.

11. The article of claim 1 , wherein the substrate is a flexible substrate including a web of polymeric material.

12. The article of claim 1 , wherein at least one of the channels extends into the pocket with the first end being underneath the solid circuit die.

13. The article of claim 1 , wherein the substrate further comprises one or more safety channels disposed adjacent to at least one of the channels, the safety channels each extend across a side wall of the pocket in a direction substantially parallel to the adjacent channel.

14. The article of claim 13 , wherein at least one of the safety channels extends to be underneath the solid circuit die.

15. The article of claim 1 , wherein the pocket is oversized such that there is a gap between edges of the pocket and the solid circuit die, the gap being at least 3 times greater than a required tolerance.

16. The article of claim 15 , wherein the channels and the gap are backfilled with an encapsulate material.

17. A method comprising:
providing a substrate having a major surface;
forming a pocket and one or more channels on the major surface of the substrate, the channels each extending between a first end and a second end thereof, the first end being fluidly connected to the pocket;
disposing a solid circuit die in the pocket, the solid circuit die having one or more contact pads on a surface thereof aligned with the first ends of the channels;
disposing an adhesive ink at the second ends of the channels, flowing the adhesive ink, primarily by a capillary pressure, in the channels toward the first ends to at least partially fill a gap between a side wall of the pocket and the solid circuit die;
disposing a conductive liquid at the second ends of the channels;
flowing the conductive liquid, primarily by a capillary pressure, in the channels toward the first ends to make direct contact with the contact pads of the solid circuit die; and
solidifying the conductive liquid to form one or more electrically conductive traces in direct contact with the contact pads of the solid circuit die.

18. The method of claim 17 further comprising forming one or more reservoirs on the major surface of the substrate and in fluid communication with the second ends of the channels, wherein the conductive liquid is dispensed into the reservoirs.

19. The method of claim 17 , wherein the solid circuit die is attached, via an adhesive, to a bottom surface of the pocket.

20. The method of claim 17 , wherein the conductive liquid flows toward and makes direct contact with one contact pad on a side surface of the solid circuit die.

21. The method of claim 17 , wherein the conductive liquid flows toward and makes direct contact with an edge portion of one contact pad on an upper surface of the solid circuit die.

22. The method of claim 17 further comprising solidifying the adhesive ink to form an adhesive layer before forming the one or more electrically conductive traces thereon.

23. The method of claim 17 , wherein the method is carried out on a roll-to-roll apparatus.

24. An article comprising:
a substrate having a major surface, wherein a pocket and one or more channels are formed on the major surface, and the channels each extend between a first end and a second end thereof, the first end being fluidly connected to the pocket;
a solid circuit die disposed in the pocket, the solid circuit die having one or more contact pads on a surface thereof aligned with the first ends of the channels; and
one or more electrically conductive traces formed in the one or more channels, the electrically conductive traces extending to the first ends of the channels and in direct contact with the contact pads of the solid circuit die,
wherein the channels comprise an inlet channel and an outlet channel each extending into the pocket and having the respective first ends fluidly connected inside the pocket to form an inner channel, at least a portion of the inner channel being underneath the solid circuit die.

25. The article of claim 24 , wherein at least one of the contact pads is located on a bottom surface of the solid circuit die, facing the inner channel.

26. An article comprising:
a substrate having a major surface, wherein a pocket and one or more channels are formed on the major surface, and the channels each extend between a first end and a second end thereof, the first end being fluidly connected to the pocket;
a solid circuit die disposed in the pocket, the solid circuit die having one or more contact pads on a surface thereof aligned with the first ends of the channels; and
one or more electrically conductive traces formed in the one or more channels, the electrically conductive traces extending to the first ends of the channels and in direct contact with the contact pads of the solid circuit die,
wherein at least one of the pockets includes a sloped sidewall, and at least one of the channels extends across the sloped sidewall.

Assignees

• 3M Innovative Properties Co

Inventors

• Mahajan Ankit
• Pekurovsky Mikhail L
• Stay Matthew S
• Theis Daniel J
• Gilman Ann M
• Dodds Shawn C
• Metzler Thomas J
• Smith Matthew R D
• Barton Roger W
• Hernandez Joseph E
• Shah Saagar A
• Meyers Kara A
• Zhu James
• Goeddel Teresa M
• Pekurovsky Lyudmila A
• Kemling Jonathan W
• Larsen Jeremy K
• Chiu Jessica
• Niccum Kayla C

Classifications

• H10W80/165

  using passive alignment, e.g. using self-alignment · CPC title

• H10W72/07521

  Aligning · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title