LED display modules and methods for making the same

Patent metadata

Field	Value
Publication number	US-10957682-B2
Application number	US-201916655538-A
Country	US
Kind code	B2
Filing date	Oct 17, 2019
Priority date	Oct 11, 2016
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.

First claim

What is claimed is:

1. A micro LED display module comprising:
a substrate comprising a plurality of control units and a plurality of micro-LED pixel units arranged in a matrix, each of the micro-LED pixel units including a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip;
a plurality of electrode patterns connected to the plurality of micro-LED chips having a size of 100 μm or less, the plurality of electrode patterns forming a predetermined height on an upper surface of the substrate; and
a light shielding wall formed between the first micro-LED chip and the second micro-LED chip and between the second micro-LED chip and the third micro-LED chip,
wherein the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip emit lights of the same wavelength and include fluorescent materials different from one another.

2. A micro LED display module according to claim 1 , wherein the light shielding wall includes upper and lower surfaces parallel to each other.

3. A micro LED display module according to claim 1 , wherein the light shielding wall includes inner side surfaces and outer side surfaces, and the inner side surfaces contact with a growth substrate of each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip.

4. A micro LED display module according to claim 1 , wherein each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip includes a light emitting surface and a pad forming surface, and the light emitting surface contacts with a wavelength converting element.

5. A micro LED display module according to claim 1 , wherein each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip includes a light emitting surface and a pad forming surface, and the pad forming surface exposes through the light shielding wall.

Assignees

• Lumens Co Ltd

Inventors

• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Shin Younghwan
• Her Jimin
• Han Sol
• Lee Kyujin

Classifications

• H10W72/01204

  using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title