Light emitting device package and light emitting device package module

Patent metadata

Field	Value
Publication number	US-10163870-B2
Application number	US-201715815667-A
Country	US
Kind code	B2
Filing date	Nov 16, 2017
Priority date	Jun 5, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

First claim

What is claimed is:

1. A light emitting device package, comprising:
a substrate including a first electrode, a second electrode, and an electrode separation portion disposed between the first electrode and the second electrode;
a first light emitting device including a first pad and a second pad, the first pad being electrically coupled to the first electrode of the substrate;
a second light emitting device including a third pad and a fourth pad, the fourth pad being electrically coupled to the second electrode of the substrate;
a pad connecting member, the pad connecting member being disposed on the substrate and configured to electrically couple the second pad of the first light emitting device and the third pad of the second light emitting device; and
an electrode separation extension portion,
wherein the substrate is configured to electrically couple the first light emitting device and the second light emitting device in series via the pad connecting member, and
wherein the electrode separation extension portion of which a width is extended is disposed on the electrode separation portion.

2. The light emitting device package of claim 1 , wherein the first light emitting device and the second light emitting device each comprise a flip-chip type light emitting diode (LED).

3. The light emitting device package of claim 1 , further comprising:
a first conductive bonding material disposed between the first electrode of the substrate and the first pad of the first light emitting device; and
a second conductive bonding material disposed between the second electrode of the substrate and the fourth pad of the second light emitting device.

4. The light emitting device package of claim 1 , wherein the pad connecting member comprises a conductive bonding material.

5. The light emitting device package of claim 1 , wherein the pad connecting member is disposed on the electrode separation portion of the substrate.

6. The light emitting device package of claim 1 , further comprising an adhesive layer disposed between the pad connecting member and the electrode separation portion of the substrate.

7. The light emitting device package of claim 1 , wherein the electrode separation portion of the substrate is disposed to separate the first electrode and the second electrode, and portions of the electrode separation portion of the substrate are disposed on portions of the first electrode and the second electrode.

8. The light emitting device package of claim 1 , wherein the electrode separation extension portion is made of the same material as that of the electrode separation portion, is formed integrally with the electrode separation portion, and is molded simultaneously with the electrode separation portion at the time of molding a reflection encapsulant of the light emitting device package.

9. The light emitting device package of claim 1 , wherein the electrode separation extension portion protrudes from the substrate supporting the first electrode and the second electrode, has a width larger than that of the electrode separation portion.

10. The light emitting device package of claim 1 , wherein the first electrode and the second electrode are inserted respectively on both sides of the electrode separation extension portion and the electrode separation portion of the substrate.

11. The light emitting device package of claim 1 , further comprising extension grooves, wherein the extension grooves are formed in the top of the first electrode and the top of the second electrode, and the electrode separation extension portion is formed in the extension grooves.

12. The light emitting device package of claim 1 , further comprising a receptacle hole formed in a top of the electrode separation extension portion, wherein the receptacle hole accommodates the pad connecting member.

13. A light emitting device package, comprising:
a substrate including a first electrode, a second electrode, and an electrode separation portion disposed between the first electrode and the second electrode;
a first light emitting device including a first pad and a second pad, the first pad being electrically coupled to the first electrode of the substrate;
a second light emitting device including a third pad and a fourth pad, the fourth pad being electrically coupled to the second electrode of the substrate; and
a pad connecting member, the pad connecting member being disposed on the substrate and configured to electrically couple the second pad of the first light emitting device and the third pad of the second light emitting device,
wherein the substrate is configured to electrically couple the first light emitting device and the second light emitting device in series via the pad connecting member,
wherein the pad connecting member is disposed in a receptacle hole on the electrode separation portion of the substrate.

14. The light emitting device package of claim 13 , wherein the pad connecting member is including an intermediate electrode, a fourth bonding medium, and a fifth bonding medium, wherein the intermediate electrode is electrically connected to the second pad of the first light emitting element by the fourth bonding medium, and electrically connected to the third pad of the second light emitting element by the fifth bonding medium.

15. The light emitting device package of claim 14 , wherein a width of the intermediate electrode is smaller than that of the electrode separation portion, and is larger than the sum of a width of the second pad and a width of the third pad.

Assignees

• Lumens Co Ltd

Inventors

• Jeon Hyo Gu
• Park Jung Hyun
• Jung Dae Gil
• Oh Seung Hyun
• Cho Yun Geon
• Kim Bo Gyun
• Han Suk Min
• Han Jun Hyeok

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/62

  Electricity · mapped topic

• H01L33/504

  Electricity · mapped topic

• H01L33/486

  Electricity · mapped topic