LED module and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10756071-B2
Application number	US-201916717696-A
Country	US
Kind code	B2
Filing date	Dec 17, 2019
Priority date	Aug 11, 2016
Publication date	Aug 25, 2020
Grant date	Aug 25, 2020

Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

First claim

What is claimed is:

1. A micro-LED display module comprising;
a substrate;
a plurality of electrode patterns arranged in a matrix on the substrate, each of the plurality of electrode patterns comprising a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad; and
a plurality of groups of LED chips arranged in the matrix on the substrate, each of the plurality of groups of LED chips comprising:
a first LED chip bonded to the first individual electrode pad and the common electrode pad;
a second LED chip bonded to the second individual electrode pad and the common electrode pad; and
a third LED chip bonded to the third individual electrode pad and the common electrode pad,

wherein the first LED chip, the second LED chip, and the third LED chip have substantially the same height from the substrate.

2. The micro-LED display module according to claim 1 , wherein the first LED chip, the second LED chip, and the third LED chip are arranged with a substantially same interval in a lengthwise direction.

3. The micro-LED display module according to claim 1 , wherein the first LED chip, the second LED chip, and the third LED chip are arrayed with a size of several tens to several hundreds of micrometers.

4. The micro-LED display module according to claim 1 , wherein each of the first LED chip, the second LED chip, and the third LED chip is bonded to the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad, respectively, via a bump, and the bump has a bonding area corresponding to 50-80% of a surface area of the corresponding individual electrode pad.

5. The micro-LED display module according to claim 1 , wherein the common electrode pad comprises a first branch disposed in parallel to the first individual electrode pad, a second branch disposed in parallel to the second individual electrode pad, and a third branch disposed in parallel to the third individual electrode pad.

6. The micro-LED display module according to claim 5 , wherein:
the first LED chip is bonded to the first individual electrode pad and the first branch of the common electrode pad,
a second LED chip is bonded to the second individual electrode pad and the second branch of the common electrode pad, and
a third LED chip is bonded to the third individual electrode pad and the third branch of the common electrode pad.

7. The micro-LED display module according to claim 6 , wherein each of the first LED chip, the second LED chip, and the third LED chip is bonded to the first branch, the second branch, and the third branch, respectively, of the common electrode pad via a bump, and the bump has a bonding area corresponding to 50-80% of a surface area of the corresponding branch of the common electrode pad.

8. The micro-LED display module according to claim 1 , wherein the substrate is flat, and the plurality of LED chips are mounted at a predetermined height from the substrate.

9. The micro-LED display module according to claim 1 , wherein the substrate comprises at least one of a rigid plastic, ceramic, or glass substrate or a flexible substrate.

10. A micro-LED display module comprising;
a substrate;
a plurality of pixels arranged in a matrix on the substrate, each of the plurality of pixels comprising:
a first individual electrode pad disposed in parallel to a first branch;
a first LED chip bonded to the first individual electrode pad and the first branch;
a second individual electrode pad disposed in parallel to a second branch;
a second LED chip bonded to the second individual electrode pad and the second branch;
a third individual electrode pad disposed in parallel to a third branch; and
a third LED chip bonded to the third individual electrode pad and the third branch,

wherein the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad are disposed in parallel to one another and at a uniform interval, and
wherein the first LED chip, the second LED chip, and the third LED chip are arrayed in a lengthwise direction at a uniform interval and have substantially the same height from the substrate.

11. The micro-LED display module according to claim 10 , wherein the first individual electrode pad, the second individual electrode pad, the third individual electrode pad, the first branch, the second branch and the third branch have substantially the same height from one another.

12. The micro-LED display module according to claim 10 , wherein the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad comprise a first end, a second end, and a third end, respectively, and the first end, the second end, and the third end are substantially aligned to an end line parallel to the lengthwise direction.

13. The micro-LED display module according to claim 10 , wherein each of the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad comprises a narrow portion and a wide portion having a width larger than that of the narrow portion, and each of the first LED chip, the second LED chip, and the third LED chip is bonded to the wide portion of the corresponding individual electrode pad.

14. The micro-LED display module according to claim 10 , wherein the first branch, the second branch, and the third branch are defined by recesses depressed inwardly from an end line parallel to the lengthwise direction.

15. The micro-LED display module according to claim 10 , wherein each of the first LED chip, the second LED chip, and the third LED chip is bonded to the corresponding individual electrode pad via a bump, and the bump has a bonding area corresponding to 50-80% of a surface area of the corresponding individual electrode pad.

16. A micro-LED display module comprising;
a substrate;
a plurality of electrode patterns arranged in a matrix on the substrate, each of the plurality of electrode patterns comprising:
a plurality of individual electrode pads aligned in a first end line parallel to a lengthwise direction; and
a common electrode pad comprising a plurality of branches aligned in a second end line parallel to the first end line; and

a plurality of groups of LED chips, each comprising a plurality of LED chips arrayed in the lengthwise direction,
wherein each of the plurality of LED chips is bonded to each of the corresponding individual electrode pads and branches, and
wherein the plurality of LED chips have substantially the same height from the substrate.

17. The micro-LED display module according to claim 16 , wherein the plurality of LED chips are arrayed at a substantially same interval in the lengthwise direction.

18. The micro-LED display module according to claim 16 , wherein each of the plurality of individual electrode pads is arranged in parallel to each of the plurality of branches and in a widthwise direction perpendicular to the lengthwise direction.

19. The micro-LED display module according to claim 16 , wherein each of the plurality of LED chips is bonded to each of the plurality of individual electrode pads via a bump, and the bump has a bonding area corresponding to 50-80% of a surface area of the corresponding individual electrode pad.

20. The micro-LED display module according to claim 16 , wherein each of the plurality of individual electrode pads comprises a narrow portion and a wide portion having a width larger than that of the narrow portion, and

Assignees

• Lumens Co Ltd

Inventors

• Yoo Taekyung
• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Her Jimin
• Shin Younghwan
• Han Sol
• Lee Kyujin

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title