Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Low-temperature nanosolders
US9463532B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9463532-B2 |
| Application number | US-201514875468-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 5, 2015 |
| Priority date | Mar 20, 2014 |
| Publication date | Oct 11, 2016 |
| Grant date | Oct 11, 2016 |
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Abstract
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A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
First claim
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We claim: 1. A method for forming a nanosolder, comprising: providing a mixture of first metal nanoparticles and second metal nanoparticles dispersed in a solution, wherein the first metal has a higher surface energy and smaller atomic size than the second metal and wherein the nanoparticles have diameters less than 100 nanometers; and heating the mixture to between 150 and 300° C. to cause the first and second metal nanoparticles to react to form a nanosolder comprising a nanop…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B23K35/0244Primary
Operations & Transport · mapped topic
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- What does patent US9463532B2 cover?
- A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of …
- Who is the assignee on this patent?
- Sandia Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K35/0244. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 11 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).