Method for cleaning and drying semiconductor substrate
US-9524863-B2 · Dec 20, 2016 · US
US10844156B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10844156-B2 |
| Application number | US-201815923556-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 16, 2018 |
| Priority date | Mar 16, 2018 |
| Publication date | Nov 24, 2020 |
| Grant date | Nov 24, 2020 |
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wherein R1, R2, R4 and R5 are independently H, an optionally substituted alkyl, an optionally substituted cycloalkyl, or an optionally substituted aryl; X is absent, HC═CH, or C≡C; and n=1, 2, 3, 4, 5, or 6.
Opening claim text (preview).
The invention claimed is: 1. A method for producing a cross-linked polymeric resin, comprising: mixing a phenol compound, an oligomer of the phenol compound, or a polymer of the phenol compound; a diol, an oligomer of the diol, or a polymer of the diol; an aldehyde; an acid; and an organic solvent to produce a reaction mixture; heating the reaction mixture at 70-200° C. to produce a precipitate; and washing and drying the precipitate to form the cross-linked polymeric resin; wherein the phenol compound is of formula I: wherein R 1 and R 2 are independently H, OR 3 , an optionally substituted alkyl, an optionally substituted cycloalkyl, or an optionally substituted aryl, and R 3 is H, an optionally substituted alkyl, an optionally substituted cycloalkyl, or an optionally substituted aryl; and wherein the diol is of formula II: wherein R 4 and R 5 are independently H, an optionally substituted alkyl, an optionally substituted cycloalkyl, or an optionally substituted aryl; X is absent, HC═CH, or C≡C; and n=1, 2, 3, 4, 5, or 6. 2. The method of claim 1 , wherein the diol, the oligomer of the diol, or the polymer of the diol, is selected from the group consisting of ethylene glycol (EG), diethylene glycol (DEG), triethyleneglycol (TEG), polyethylene glycol (PEG), polypropylene glycol (PPG), and polybutylene glycol (PBG). 3. The method of claim 1 , wherein the organic solvent is at least one selected from the group consisting of n-pentane, isopentane, hexane, heptane, and octane. 4. The method of claim 1 , wherein the reaction mixture is heated to 85-95° C. to form the precipitate. 5. The method of claim 1 , wherein the phenol compound is phenol. 6. The method of claim 1 , wherein the aldehyde is formaldehyde. 7. The method of claim 1 , wherein a molar ratio of the aldehyde to the phenol compound, the oligomer of the phenol compound, or the polymer of the phenol compound in the reaction mixture is 4:1 to 8:1. 8. The method of claim 1 , wherein a molar ratio of the diol, the oligomer of the diol, or the polymer of the diol to the phenol compound, the oligomer of the phenol compound, or the polymer of the phenol compound in the reaction mixture is 1:1 to 5:1.
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