Bonding wire for semiconductor device

Patent metadata

Field	Value
Publication number	US-10840208-B2
Application number	US-201515537390-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Dec 17, 2014
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 μm in thickness.

First claim

The invention claimed is:

1. A bonding wire for a semiconductor device comprising:
a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at%, and a balance being made up of Ag and incidental impurities; and
a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, and a balance being made up of incidental impurities, wherein
the coating layer is 0.005 to 0.070 μm in thickness.

2. The bonding wire according to claim 1 , further comprising an alloy layer provided between the core material and the coating layer, the alloy layer containing one or more of Ga, In, and Sn, one or more of Pd and Pt, and Ag, and a balance being made up of incidental impurities.

3. The bonding wire according to claim 2 , wherein a thickness of the alloy layer is 10 to 60% the thickness of the coating layer.

4. The bonding wire according to claim 3 , further comprising a Au-containing region containing 15 to 50 at.% Au and provided on an outermost surface of the coating layer, wherein a thickness of the Au-containing region is 0.001 to 0.050 μm.

5. The bonding wire according to claim 1 , wherein the core material further contains one or more of Cu, Pd, Pt, and Au for a total of 0.1 to 0.7 at.%.

6. The bonding wire according to claim 1 , wherein the bonding wire as a whole contains one or more of B, P, Ca, La, and Se for a total of 80 to 500 at. ppm.

7. The bonding wire according to claim 2 , wherein the core material further contains one or more of Cu, Pd, Pt, and Au for a total of 0.1 to 0.7 at.%.

8. The bonding wire according to claim 3 , wherein the core material further contains one or more of Cu, Pd, Pt, and Au for a total of 0.1 to 0.7 at.%.

9. The bonding wire according to claim 2 , wherein the bonding wire as a whole contains one or more of B, P, Ca, La, and Se for a total of 80 to 500 at. ppm.

10. The bonding wire according to claim 3 , wherein the bonding wire as a whole contains one or more of B, P, Ca, La, and Se for a total of 80 to 500 at. ppm.

11. The bonding wire according to claim 5 , wherein the bonding wire as a whole contains one or more of B, P, Ca, La, and Se for a total of 80 to 500 at. ppm.

12. A bonding wire for a semiconductor device comprising:
a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at%, and a balance being made up of Ag and incidental impurities;
a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, and a balance being made up of incidental impurities; and
a Au-containing region containing 15 to 50 at.% Au and provided on an outermost surface of the coating layer; wherein
the coating layer is 0.005 to 0.070 μm in thickness, and
a thickness of the Au-containing region is 0.001 to 0.050 μm.

Assignees

• Nippon Steel Chemical & Mat Co Ltd
• Nippon Micrometal Corp

Inventors

• Oyamada Tetsuya
• Uno Tomohiro
• Oda Daizo
• Yamada Takashi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07555

  changes in materials · CPC title

• H10W72/07541

  Controlling the environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07533

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title