Limiting electronic package warpage

Patent metadata

Field	Value
Publication number	US-10056268-B2
Application number	US-201715792803-A
Country	US
Kind code	B2
Filing date	Oct 25, 2017
Priority date	May 28, 2015
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

An electronic package includes a carrier, semiconductor chip, a lid, and a lid-ring. The carrier includes a top surface and a bottom surface configured to be electrically connected to a system board. The semiconductor chip is electrically connected to the top surface. The lid is attached to the top surface enclosing semiconductor chip and includes a perimeter recess. The lid-ring is juxtaposed within the perimeter recess. The lid-ring exerts a reverse bending moment upon the lid to limit warpage of the electronic package.

First claim

The invention claimed is:

1. A electronic package comprising:
a carrier comprising a top surface and a bottom surface configured to be electrically connected to a system board;
a semiconductor chip electrically connected to the top surface of the carrier;
a lid attached to the top surface of the carrier that encloses semiconductor chip, the lid comprising a perimeter recess within the upper half of the lid, the perimeter recess comprising a horizontal recess and vertical recess comprising two recess sidewalls; and
a lid-ring attached to the lid within the perimeter recess, the lid ring comprising a horizontal portion orthogonal and distally connected to a vertical portion, wherein the horizontal portion comprises a greater width than height, is parallel with the semiconductor chip, and is juxtaposed within the horizontal recess, wherein the vertical portion comprises a greater height than width and is juxtaposed between the two vertical recess sidewalls, wherein a perimeter sidewall of the lid-ring horizontal portion is coplanar with a perimeter sidewall of the lid, and wherein the lid-ring applies a contracting force against the upper half of the lid to exert a reverse bending moment upon the lid.

2. The electronic package of claim 1 , wherein the lid is in thermal contact with the semiconductor chip.

3. The electronic package of claim 1 , wherein a top surface of the lid and a top surface the lid-ring are coplanar.

4. The electronic package of claim 1 , wherein the lid and the lid-ring are the same material.

5. The electronic package of claim 1 , wherein the lid is fabricated from copper and the lid-ring is fabricated from aluminum.

6. The electronic package of claim 1 , further comprising:
a heat sink thermally attached to a top surface of the lid.

7. The electronic package of claim 6 , wherein the heat sink is further thermally attached to a top surface of the lid ring.

8. A electronic device comprising:
a carrier comprising a top surface and a bottom surface configured to be electrically connected to a system board;
a semiconductor chip electrically connected to the top surface of the carrier;
a lid attached to the top surface of the carrier that encloses semiconductor chip, the lid comprising a perimeter recess within the upper half of the lid, the perimeter recess comprising a horizontal recess and vertical recess comprising two recess sidewalls; and
a lid-ring attached to the lid within the perimeter recess, the lid ring comprising a horizontal portion orthogonal and distally connected to a vertical portion, wherein the horizontal portion comprises a greater width than height, is parallel with the semiconductor chip, and is juxtaposed within the horizontal recess, wherein the vertical portion comprises a greater height than width and is juxtaposed between the two vertical recess sidewalls, wherein a perimeter sidewall of the lid-ring horizontal portion is coplanar with a perimeter sidewall of the lid, and wherein the lid-ring applies a contracting force against the upper half of the lid to exert a reverse bending moment upon the lid.

9. The electronic device of claim 8 , wherein the lid is in thermal contact with the semiconductor chip.

10. The electronic device of claim 8 , wherein a top surface of the lid and a top surface the lid-ring are coplanar.

11. The electronic device of claim 8 , wherein the lid and the lid-ring are the same material.

12. The electronic device of claim 8 , wherein the lid is fabricated from copper and the lid-ring is fabricated from aluminum.

13. The electronic device of claim 8 , further comprising:
a heat sink thermally attached to a top surface of the lid.

14. The electronic device of claim 13 , wherein the heat sink is further thermally attached to a top surface of the lid ring.

Assignees

• IBM

Inventors

• Li Shidong

Classifications

• H10W76/17

  characterised by their materials · CPC title

• H10W76/67

  characterised by their materials · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title