Plating method, plating apparatus and recording medium

Patent metadata

Field	Value
Publication number	US-10784111-B2
Application number	US-201716345385-A
Country	US
Kind code	B2
Filing date	Aug 29, 2017
Priority date	Oct 27, 2016
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion 32 by supplying a catalyst solution N1 onto the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. A pH of the catalyst solution N1 is previously adjusted such that the plating layer 35 is suppressed from being precipitated on the non-plateable material portion 31 while being facilitated to be precipitated on the plateable material portion 32.

First claim

We claim:

1. A plating method, comprising:
preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface thereof;
imparting a catalyst selectively to the plateable material portion by supplying a catalyst solution onto the substrate; and
forming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate,
wherein a pH of the catalyst solution is previously adjusted to be in a pH range between isoelectric points of a main component of the non-plateable material portion and a main component of the plateable material portion such that the plating layer is suppressed from being precipitated on the non-plateable material portion while being facilitated to be precipitated on the plateable material portion.

2. A plating method, comprising:
preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface thereof;
imparting a catalyst selectively to the plateable material portion by supplying a catalyst solution onto the substrate; and
forming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate,
wherein a pH of the catalyst solution is previously adjusted such that the plating layer is suppressed from being precipitated on the non-plateable material portion while being facilitated to be precipitated on the plateable material portion, and
wherein the non-plateable material portion is made of SiO 2 as a main component,
the plateable material portion is made of SiN as a main component, and
the pH falls within a range from 2 to 3.

3. The plating method of claim 1 ,
wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• IWAI Kazutoshi

Classifications

• H10P14/46 Primary

  using a liquid · CPC title

• C23C18/36 Primary

  using hypophosphites · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title

• C23C18/30

  Activating {or accelerating or sensitising with palladium or other noble metal} · CPC title

• C23C18/1675

  Process conditions · CPC title