Bonding device

Patent metadata

Field	Value
Publication number	US-10780684-B2
Application number	US-201716097520-A
Country	US
Kind code	B2
Filing date	Apr 28, 2017
Priority date	Apr 29, 2016
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

A bonding device includes a flexible platen disposed between an upper platen assembly (9) and a transmission device and within a vacuum chamber (6). The flexible platen can expand to apply a downward pressure to the upper platen assembly (9) connected thereto. Under the effect of the pressure, the upper platen assembly (9) slowly moves downward until the upper platen assembly (9) itself and a lower platen assembly (7) respectively come into tight contact with objects to be bonded. After that, the flexible platen continues exerting the downward pressure on the upper platen assembly (9). In this way, the pressure applied by the upper platen assembly (9) to the objects to be bonded is uniform. Meanwhile, because of slow expansion of the flexible platen, the uniform pressure is applied slowly by the upper platen assembly (9).

First claim

What is claimed is:

1. A bonding device, comprising from top down:
a driving device;
a transmission device, in fixed connection with the driving device;
an upper platen assembly, connected to the transmission device;
a lower platen assembly in cooperation with the upper platen assembly, the lower platen assembly configured to support objects to be bonded that are disposed between the lower platen assembly and the upper platen assembly; and
a vacuum chamber, in which the upper platen assembly and the lower platen assembly are both housed,
wherein the upper platen assembly is connected to the transmission device by a flexible platen which is able to expand so as to allow the upper platen assembly to apply a uniform pressure to the objects to be bonded,
wherein the transmission device comprises a main shaft fixed to a top of the flexible platen, the vacuum chamber comprising a top chamber wall, the main shaft extending from an interior of the vacuum chamber through the top chamber wall to an exterior of the vacuum chamber, wherein guide shafts are provided on the top chamber wall and distributed uniformly around the main shaft, a top of the main shaft provided with an upper flange that is diametrically greater than the main shaft, and the guide shafts slidably engaged with the upper flange so that the main shaft is moveable up and down along the guide shafts.

2. The bonding device of claim 1 , wherein a rotation locking mechanism is connected between the flexible platen and the transmission device and is configured to prevent the upper platen assembly from rotating about a central axis of the transmission device.

3. The bonding device of claim 1 , wherein the flexible platen comprises, an upper plate and a lower plate, the upper plate connected to the lower plate by an expandable member.

4. The bonding device of claim 3 , wherein the expandable member comprises lower bellows that are connected at a first end to the upper plate and at a second end to the lower plate.

5. The bonding device of claim 3 , wherein a locking mechanism of the expandable member is further disposed between the upper plate and the lower plate and is configured to limit expansion and contraction of the expandable member.

6. The bonding device of claim 1 , wherein is fixedly connected to the driving device.

7. The bonding device of claim 6 , wherein the main shaft is fixed to the top of the flexible platen through a spherical plain thrust bearing.

8. The bonding device of claim 6 , wherein the top chamber wall is located in an upper portion of the vacuum chamber and the vacuum chamber further comprises a bottom chamber wall located in a lower portion thereof.

9. The bonding device of claim 1 , wherein the upper flange defines circular holes corresponding to the guide shafts, wherein the guide shafts are inserted through the circular holes, and wherein the guide shafts form clearance fits with the corresponding circular holes.

10. The bonding device of claim 1 , wherein the main shaft defines a deep bore and is connected to the driving device by a tapered shaft screw that is disposed within the deep bore, and wherein the tapered shaft screw forms a clearance fit with the deep bore.

11. The bonding device of claim 10 , wherein a screw nut is fixedly connected to an end face of the upper flange and has an internal thread that is engaged with the tapered shaft screw so that the screw nut is disposed over the tapered shaft screw in threaded fit.

12. The bonding device of claim 11 , wherein a lower flange surrounding the main shaft is disposed on the top chamber wall, wherein the transmission device is provided with a plurality of upper bellows that are fastened at one end to the upper flange and at the other end to the lower flange, and wherein each of the plurality of upper bellows has a radius smaller than a distance between a central axis of the main shaft and a central axis of any one of the guide shafts.

13. The bonding device of claim 11 , wherein a thrust bearing is disposed over the tapered shaft screw between the driving device and the screw nut.

14. The bonding device of claim 1 , wherein the driving device is a motor.

Assignees

• Shanghai Micro Electronics Equipment Group Co Ltd

Inventors

• Fu Hui
• Shang Feixiang

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/57

  Mask-wafer alignment · CPC title