Apparatus for processing a substrate and display device by using the same

Patent metadata

Field	Value
Publication number	US-10748771-B2
Application number	US-201916283392-A
Country	US
Kind code	B2
Filing date	Feb 22, 2019
Priority date	Jul 12, 2016
Publication date	Aug 18, 2020
Grant date	Aug 18, 2020

Abstract

Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

First claim

What is claimed is:

1. A cutting apparatus for forming a hole in a substrate, comprising:
a cutting tip, the cutting tip having a first, second, third, and fourth inclined surface, wherein the first inclined surface and the second inclined surface meet to form a tip having an acute angle formed based on the first and second inclined surface, the third inclined surface extends from the first inclined surface and the fourth inclined surface extends from the second inclined surface;
a first acute angle that the first inclined surface forms with a surface of the substrate;
a second acute angle that the second inclined surface forms with the surface of the substrate, the first acute angle is smaller than the second acute angle;
a third acute angle that the third inclined surface forms with the surface of the substrate, the third acute angle is larger than the first acute angle; and
a fourth acute angle that the fourth inclined surface forms with the surface of the substrate, the fourth acute angle is smaller than the second acute angle, wherein a width of the first inclined surface as projected to the surface of the substrate is greater than a sum of a width of the second inclined surface as projected to the surface of the substrate and a width of the fourth inclined surface as projected to the surface of the substrate.

2. A cutting apparatus of claim 1 , wherein a sum of the acute angle between the first and second inclined surface, the first acute angle, and the second acute angle is 180°.

3. A cutting apparatus of claim 1 , wherein the cutting tip includes a plurality of sub-cutting tips spaced from each other to form a gap between the respective sub-cutting tips.

4. A cutting apparatus of claim 3 , wherein the respective sub-cutting tip includes an arc-shaped cutting portion.

5. A cutting apparatus of claim 1 , wherein a boundary portion between the second inclined surface and the fourth inclined surface has a recessed shape or a concave shape slightly bent toward an inner side of the cutting tip.

Assignees

• Lg Display Co Ltd

Inventors

• Park Jeong Kweon
• Lee Jeong Joon
• Hong Ju Ik
• Lee Sang Chul
• Kim Jangcheol
• Kuon Ik Hyun
• Choi Tagyoung
• Kwak Jinwook

Classifications

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• H10P90/1914 Primary

  using bonding · CPC title

• B24B19/02 Primary

  for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements · CPC title

• H10F71/1221

  comprising polycrystalline silicon · CPC title

• B26F1/16

  Perforating by tool or tools of the drill type · CPC title