Composition for metal electroplating comprising leveling agent
US-9758885-B2 · Sep 12, 2017 · US
Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
US10738388B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10738388-B2 |
| Application number | US-201515752606-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 8, 2015 |
| Priority date | Oct 8, 2015 |
| Publication date | Aug 11, 2020 |
| Grant date | Aug 11, 2020 |
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- Title
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Abstract
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Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
First claim
Opening claim text (preview).
What is claimed is: 1. An electroplating bath comprising one or more sources of copper ions, one or more accelerators, one or more suppressors, one or more electrolytes and one or more compounds comprising a reaction product of an amine and an acrylamide, wherein the amine has a formula: wherein r, s and t are independently numbers from 1 to 10; and the acrylamide has a formula: wherein R″ comprises a moiety having a structure: or a moiety having a structure: wherein R 15 comprises hydrogen or hydroxyl; u is an integer from 1 to 2 and v, x, and y are independently integers of 1 to 10. 2. The electroplating bath of claim 1 , wherein the compound is in amounts of 0.01 ppm to 1000 ppm. 3. The electroplating bath of claim 1 , further comprising one or more sources of tin ions. 4. A method of electroplating comprising: a) providing a substrate; b) immersing the substrate in the electroplating bath of claim 1 ; c) applying a current to the substrate and the electroplating bath; and d) electroplating copper on the substrate. 5. The method of claim 4 , wherein the substrate comprises one or more of through-holes and blind vias.
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Classifications
Semiconductors · CPC title
Semiconductors first coated with a seed layer or a conductive layer · CPC title
Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title
containing more than 50% by weight of copper · CPC title
- C25D3/38Primary
of copper · CPC title
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Frequently asked questions
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- What does patent US10738388B2 cover?
- Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
- Who is the assignee on this patent?
- Dow Global Technologies Llc, Rohm & Haas Elect Mat
- What technology area does this patent fall under?
- Primary CPC classification C25D3/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).