Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10735637-B2
Application number	US-201916436934-A
Country	US
Kind code	B2
Filing date	Jun 11, 2019
Priority date	Mar 12, 2016
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

First claim

What is claimed is:

1. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up said circuit elements and said connecting elements, wherein said installing section is adapted for enabling the camera lens to be installed thereon and aligned at a photosensitive path of said photosensitive sensor and positioned above said window;
a motor unit mounted on said top surface of said encapsulation portion and electrically connected to said main circuit board; and
a motor connecting structure which is arranged for connecting to said motor unit and includes at least one carving line arranged to electrically connect said one or more connecting elements, said photosensitive sensor and said motor unit on said main circuit board.

2. The photosensitive unit, as recited in claim 1 , wherein said at least one carving line is formed on a surface of said encapsulation portion providing an electrical circuit connection with said one or more connecting elements, said photosensitive sensor and said motor unit.

3. The photosensitive unit, as recited in claim 2 , wherein said at least one carving line is formed by providing at least one carving slot in said encapsulation portion and then electroplating said at least one caving slot to form said at least one carving line for electrically connecting said motor unit with said main circuit board of said photosensitive portion.

4. The photosensitive unit, as recited in claim 3 , wherein said photosensitive portion further includes a reinforced layer overlappedly attached to a bottom of said main circuit board so as to reinforce a structural strength of said main circuit board and enhance a heat dissipation of said photosensitive unit.

5. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up said circuit elements and said connecting elements, wherein said installing section is adapted for enabling the camera lens to be installed thereon and aligned at a photosensitive path of said photosensitive sensor and positioned above said window, wherein a molding area of said encapsulation portion is extended inwardly to reduce outer structural portions of said encapsulation portion and said main circuit board so as to reduce a size in length and width of said photosensitive unit; and
an optical filter which is molded to overlappedly disposed on said photosensitive sensor, wherein edges of said optical filter are molded by said encapsulation portion so as to affix said optical filter in position.

6. The photosensitive unit, as recited in claim 5 , wherein said photosensitive portion further includes a reinforced layer overlappedly attached to a bottom of said main circuit board so as to reinforce a structural strength of said main circuit board and enhance a heat dissipation of said photosensitive unit.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Chen Feifan
• Mei Qimin
• Ding Liang
• Jiang Heng

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title