Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10084949-B2
Application number	US-201715460236-A
Country	US
Kind code	B2
Filing date	Mar 16, 2017
Priority date	Mar 12, 2016
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

First claim

What is claimed is:

1. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said window gradually reduces a size thereof from top to bottom to define a larger upper size and a smaller lower size so as to enable said photosensitive sensor receiving more light, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up said circuit elements and said connecting elements, wherein said installing section is adapted for enabling the camera lens to be installed thereon and aligned at a photosensitive path of said photosensitive sensor and positioned above said window, wherein a top surface of said installing section is molded to an even and flat manner for facilitating an installing of the camera lens and ensuring one or more lenses of the camera lens being parallel to said photosensitive area of said photosensitive sensor;
an optical filter stably mounted on said top surface of said installing section of said encapsulation portion and positioned above said window of said encapsulation portion to ensure said optical filter being deployed along said photosensitive path of said photosensitive sensor; and
a motor unit mounted on said top surface of said installing section of said encapsulation portion and electrically connected to said main circuit board.

2. The photosensitive unit, as recited in claim 1 , wherein a molding area of said encapsulation portion is extended inwardly to reduce outer structural portions of said encapsulation portion and said main circuit board so as to reduce a size in length and width of said photosensitive unit.

3. The photosensitive unit, as recited in claim 1 , wherein said main circuit board is processed by Surface Mount Technology (SMT) before said encapsulation portion is molded thereon, wherein said main circuit board is selected from the group consisting of rigid-flex board, ceramic substrate, and rigid PCB, wherein a molding material of said encapsulation portion is selected from the group consisting of nylon, liquid crystal polymer (LCP), or polypropylene (PP) for injection molding technique, or resin.

4. The photosensitive unit, as recited in claim 1 , wherein said photosensitive portion further includes a reinforced layer overlappedly attached to a bottom of said main circuit board corresponding to positions of said encapsulation portion and said photosensitive sensor so as to reinforce a structural strength of said main circuit board and enhance a heat dissipation of said photosensitive unit.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Chen Feifan
• Mei Qimin
• Ding Liang
• Jiang Heng

Classifications

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title