Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10367983-B2
Application number	US-201816101509-A
Country	US
Kind code	B2
Filing date	Aug 12, 2018
Priority date	Mar 12, 2016
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

First claim

What is claimed is:

1. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said window gradually reduces a size thereof from top to bottom to define a larger upper size and a smaller lower size so as to enable said photosensitive sensor receiving more light, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up said circuit elements and said connecting elements, wherein said installing section is adapted for enabling the camera lens to be installed thereon and aligned at a photosensitive path of said photosensitive sensor and positioned above said window, wherein a top surface of said installing section is molded to an even and flat manner for facilitating an installing of the camera lens and ensuring one or more lenses of the camera lens being parallel to said photosensitive area of said photosensitive sensor, wherein said installing section of said encapsulation portion has at least an annular installing groove provided on top of said encapsulation portion and communicated with said window to provide an adequate installation space for installing an optical filter therein so as to ensure a top surface of the optical filter mounted on said installing groove being not protruded on top surface of said encapsulation portion; and
a motor unit mounted on said top surface of said encapsulation portion and electrically connected to said main circuit board.

2. The photosensitive unit, as recited in claim 1 , wherein said encapsulation portion is molded on said main circuit board while encapsulating and wrapping up said circuit elements and connecting elements without a need to provide any spare, adhering and affixing space, and thus a thickness of the encapsulation portion is able to be minimized to just wrapping up said circuit elements and said connecting elements, and that said installing section of said encapsulation portion is adapted for enabling the optical filter to be attached on said top surface of said installing section which enables a shorter back focal length of the camera lens and further reduces a thickness of the camera module.

3. The photosensitive unit, as recited in claim 2 , wherein a molding area of said encapsulation portion is extended inwardly to reduce outer structural portions of said encapsulation portion and said main circuit board so as to reduce a size in length and width of said photosensitive unit.

4. The photosensitive unit, as recited in claim 3 , wherein said installing groove has a flat bottom surface, in parallel with said photosensitive area of said photosensitive sensor, for an outer bottom peripheral portion of the optical filter being attached thereon for ensuring the optical filter being mounted in parallel with said photosensitive sensor.

5. The photosensitive unit, as recited in claim 4 , wherein said main circuit board is processed by Surface Mount Technology (SMT) before said encapsulation portion is molded thereon, wherein said main circuit board is selected from the group consisting of rigid-flex board, ceramic substrate, and rigid PCB, wherein a molding material of said encapsulation portion is selected from the group consisting of nylon, liquid crystal polymer (LCP), or polypropylene (PP) for injection molding technique, or resin.

6. The photosensitive unit, as recited in claim 2 , wherein said installing groove has a flat bottom surface, in parallel with said photosensitive area of said photosensitive sensor, for an outer bottom peripheral portion of the optical filter being attached thereon for ensuring the optical filter being mounted in parallel with said photosensitive sensor.

7. The photosensitive unit, as recited in claim 2 , wherein said main circuit board is processed by Surface Mount Technology (SMT) before said encapsulation portion is molded thereon, wherein said main circuit board is selected from the group consisting of rigid-flex board, ceramic substrate, and rigid PCB, wherein a molding material of said encapsulation portion is selected from the group consisting of nylon, liquid crystal polymer (LCP), or polypropylene (PP) for injection molding technique, or resin.

8. The photosensitive unit, as recited in claim 1 , wherein a molding area of said encapsulation portion is extended inwardly to reduce outer structural portions of said encapsulation portion and said main circuit board so as to reduce a size in length and width of said photosensitive unit.

9. The photosensitive unit, as recited in claim 1 , wherein said installing groove has a flat bottom surface, in parallel with said photosensitive area of said photosensitive sensor, for an outer bottom peripheral portion of the optical filter being attached thereon for ensuring the optical filter being mounted in parallel with said photosensitive sensor.

10. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said window gradually reduces a size thereof from top to bottom to define a larger upper size and a smaller lower size so as to enable said photosensitive sensor receiving more light, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up s

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Chen Feifan
• Mei Qimin
• Ding Liang
• Jiang Heng

Classifications

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N13/239 Primary

  using two two-dimensional [2D] image sensors having a relative position equal to or related to the interocular distance (H04N13/243 takes precedence) · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title