Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same
US-9803283-B1 · Oct 31, 2017 · US
Electroless plating composition for electroless deposition of aluminum or aluminum alloy and article including electroless deposited aluminum layer
US10711351B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10711351-B1 |
| Application number | US-201715665011-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jul 31, 2017 |
| Priority date | Oct 18, 2013 |
| Publication date | Jul 14, 2020 |
| Grant date | Jul 14, 2020 |
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- Title
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Abstract
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An article includes an electroless deposited aluminum layer. The aluminum layer is deposited in an electroless plating composition. The composition includes an aluminum ionic liquid, a reducing agent, and an additive selected from the group consisting of a catalyst, an alloying element, and a combination thereof.
First claim
Opening claim text (preview).
What is claimed is: 1. An electroless plating composition, comprising: an aluminum ionic liquid; a reducing agent; and an additive selected from the group consisting of a catalyst, an alloying element, and a combination thereof, wherein the additive comprises the catalyst, and the catalyst is selected from the group consisting of TiCl 2 , TiCl 3 , TiCl 4 , ZrCl 4 , VCl 3 , NbCl 5 , CeCl 3 and combinations thereof. 2. The electroless plating composition of claim 1 , wherein the reducing agent is selected from the group consisting of alkali metal hydrides, alkaline earth metal hydrides, alanate salts of alkali metal, alanate salts of alkaline earth metal, borohydride salts, hydrided alkyl-metal compounds, and combinations thereof. 3. The electroless plating composition of claim 1 , wherein the reducing agent is lithium hydride, di-isobutyl aluminum hydride, NaAlH 4 , LiBH 4 or NaBH 4 . 4. The electroless plating composition of claim 1 , wherein the aluminum ionic liquid comprises 1-ethyl-3-methylimidazolium chloride, N-alkylpyridinium halides, N-alkylimidazolium halides, N,N′-alkylimidazolium halides, N-alkylpyrazolium halides, N,N′-alkylpyrazolium halides, bis(trifluoromethylsulfonyl) amide, tris(pentafluoroethyl)trifluorophosphate, trifluoroacetate, trifluoromethylsulfonate, dicyanoamide, tricyanomethide, tetracyanoborate, tetraphenylborate, tris(trifluoromethylsulfonyl) methide, thiocyanate, or a combination thereof. 5. The electroless plating composition of claim 1 , further comprising particulates about 10 nm to about 100 microns in diameter and/or selected from MgSi, SiC, CrC, TiC, BN, BC, diamond, metal, metal alloy, and combinations thereof. 6. The electroless plating composition of claim 1 , wherein the additive further comprises the alloying element.
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Classifications
Coating with alloys · CPC title
Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title
Two or more layers only obtained by electroless plating · CPC title
- C23C18/1687Primary
with ionic liquid · CPC title
Electroless forming, i.e. substrate removed or destroyed at the end of the process · CPC title
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Frequently asked questions
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- What does patent US10711351B1 cover?
- An article includes an electroless deposited aluminum layer. The aluminum layer is deposited in an electroless plating composition. The composition includes an aluminum ionic liquid, a reducing agent, and an additive selected from the group consisting of a catalyst, an alloying element, and a combination thereof.
- Who is the assignee on this patent?
- Hrl Lab Llc
- What technology area does this patent fall under?
- Primary CPC classification C23C18/1687. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).