Integrated vapor chamber for thermal management of computing devices

Patent metadata

Field	Value
Publication number	US-10698458-B2
Application number	US-201414294040-A
Country	US
Kind code	B2
Filing date	Jun 2, 2014
Priority date	Jun 2, 2014
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.

First claim

What is claimed is:

1. A computing device, comprising:
a display;
a first heat source;
a second heat source;
a touch display module (TDM) disposed between the display on a first side of the TDM and the second heat source on a second opposing side of the TDM, the TDM providing functionality to the display, the TDM comprising:
an upper metallic portion spanning across the TDM and proximate to the first heat source;
a lower portion opposite the upper metallic portion and proximate to the second heat source;
a surrounding portion between the upper metallic portion and the lower portion; and
a sealed space forming a vapor chamber configured to absorb heat from each of the first and second heat sources, the sealed space bounded by the upper metallic portion, the lower portion, and the surrounding portion, and disposed between the first and second heat sources; and
the sealed space being at least partially filled with a phase change fluid,
wherein, during operation of the computing device, the phase change fluid transitions between liquid and vapor forms to facilitate transferring heat from the first and second heat sources to one or more external surfaces of the computing device.

2. The computing device of claim 1 , wherein the upper metallic portion, the lower portion and the surrounding portion replace a piece of metal spanning the second opposing side of the TDM.

3. The computing device of claim 1 , wherein a phase change of the phase change fluid include one of:
evaporation causing the phase change fluid to change from a liquid to a vapor, or
condensation causing the phase change fluid to change from the vapor to the liquid.

4. The computing device of claim 3 , wherein a portion of the phase change fluid that is the vapor is located within a vapor layer surrounded by one or more liquid layers comprising a remaining portion of the phase change fluid that is the liquid.

5. The computing device of claim 1 , wherein a rate of heat transfer is increased by forcing air over the one or more external surfaces of the computing device through one of a fan and a blower.

6. The computing device of claim 5 , wherein the rate of heat transfer is increased by employing a heat sink on the one or more external surfaces of the computing device.

7. The computing device of claim 6 , wherein the heat sink is configured to dissipate the heat from the one or more external surfaces of the computing device into an ambient environment surrounding the computing device.

8. The computing device of claim 1 , wherein the sealed space forming the vapor chamber is located in a center of the computing device.

9. The computing device of claim 1 , wherein the upper metallic portion spans at least one dimension of the computing device.

10. The computing device of claim 1 , wherein the computing device is a wearable device.

11. The computing device of claim 1 , wherein the computing device is maintained at a safe temperature during the operation of the computing device.

12. The computing device of claim 1 , wherein a plurality of the one or more external surfaces radiate the heat away from the computing device.

13. The computing device of claim 1 , wherein the upper metallic portion spans an entirety of the TDM.

14. The computing device of claim 1 , wherein the upper metallic portion is aluminum.

15. The computing device of claim 1 , further comprising:
a back case structurally containing computational components within the computing device.

16. The computing device of claim 1 , wherein the functionality provided by the TDM to the display is electrical touch display functionality.

17. A computing device comprising:
a display;
a first heat source;
a second heat source;
a touch display module (TDM) disposed between the display on a first side of the TDM and the second heat source on a second opposing side of the TDM, the TDM providing functionality to the display, the TDM comprising:
an upper aluminum portion spanning across the TDM and proximate to the first heat source;
a lower portion opposite the upper aluminum portion and proximate to the second heat source;
a surrounding portion between the upper aluminum portion and the lower portion;

and
a sealed space forming a vapor chamber configured to absorb heat from each of the first and second heat sources, the sealed space bounded by the upper aluminum portion, the lower portion, and the surrounding portion, and disposed between the first and second heat sources; and
the sealed space being at least partially filled with a phase change fluid,
wherein, during operation of the computing device, the phase change fluid transitions between liquid and vapor forms to facilitate transferring heat from the first and second heat sources to one or more external surfaces of the computing device.

18. The computing device of claim 17 , wherein the upper aluminum portion spans an entirety of the lower portion of the TDM.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Delano Andrew
• Stellman Taylor

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/02

  in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/20 Primary

  Cooling means · CPC title