Support frame with integrated phase change material for thermal management

Patent metadata

Field	Value
Publication number	US-9836100-B2
Application number	US-201414515138-A
Country	US
Kind code	B2
Filing date	Oct 15, 2014
Priority date	Oct 15, 2014
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.

First claim

What is claimed is:

1. A mobile computing device, comprising:
a front panel;
a back panel;
a plurality of components arranged in a component layer stack, the component layer stack including a printed circuit board and at least one processor;
a monolithic mid-frame disposed between the front panel and the back panel, wherein the mid-frame includes a closed cavity, the closed cavity being filled with a first phase change material, and wherein the mid-frame is configured to provide mechanical support for the component layer stack of the mobile computing device between the front panel and the back panel and to absorb heat produced by the plurality of components.

2. The mobile computing device according to claim 1 , wherein at least one component of the plurality of components is configured to throttle a performance of the at least one component when heat produced by the at least one component exceeds a threshold.

3. The mobile computing device according to claim 2 , wherein the first phase change material substantially delays a throttling of the performance of the at least one component by absorbing the heat produced by the at least one component.

4. The mobile computing device of claim 3 , wherein the first phase change material comprises a structure of phase change material.

5. The mobile computing device of claim 1 , wherein the first phase change material comprises at least one of:
a solid-liquid phase change material;
a liquid-vapor phase change material; or
a crystalline to amorphous structure phase change material.

6. The mobile computing device of claim 5 , wherein the first phase change material has a state change point that corresponds to an initial increase in a temperature of at least one component of the plurality of components.

7. The mobile computing device of claim 5 , wherein the first phase change material is configured to change a current state of the first phase change material when the heat produced by the plurality of components and absorbed by the first phase change material exceeds a state change point of the first phase change material.

8. The mobile computing device of claim 1 , wherein the first phase change material has a higher latent heat capacitance than a material comprising the mid-frame.

9. The mobile computing device of claim 1 , wherein at least one component of the plurality of components includes firmware executing in the mobile computing device, and wherein the firmware is configured to throttle a performance of the at least one component when heat produced by the at least one component exceeds a threshold.

10. The mobile computing device of claim 1 , wherein the mid-frame comprises a metal frame.

11. The mobile computing device of claim 1 , further comprising a heat spreader proximately positioned with respect to the first phase change material, the heat spreader being configured to evenly distribute the heat across the first phase change material.

12. The mobile computing device of claim 1 , wherein the first phase change material is configured to absorb heat generated by a component included in the plurality of components of the mobile computing device, the component being positioned proximate to the mid-frame.

13. The mobile computing device of claim 12 , wherein a firmware corresponding to the component is configured to throttle a performance level of the component when the heat generated by the component exceeds a threshold.

14. The mobile computing device of claim 13 , wherein the first phase change material is configured to delay a throttling of the performance level of the component due to generation of the heat by the component.

15. The mobile computing device of claim 12 , wherein the first phase change material has a melting point that corresponds to an initial increase in a temperature of the component.

16. The mobile computing device of claim 1 , further comprising:
a rechargeable power source comprised in the mobile computing device and configured to provide power for the mobile computing device;
a rechargeable power source cover comprised in the mobile computing device and configured to provide mechanical support for the rechargeable power source; and
a second phase change material integrated into the rechargeable power source cover and configured to absorb heat produced by the rechargeable power source.

17. The mobile computing device of claim 1 , further comprising:
the printed circuit board (PCB) arranged between the front and back panels;
a shielding layer positioned adjacent to the PCB and between the PCB and one of the front panel or back panel, wherein the shielding layer includes a second phase change material integrated monolithically with the shielding layer and configured to absorb heat produced by the PCB.

18. The mobile computing device of claim 1 , further comprising:
a camera module comprising a light-emitting diode (LED) device, the camera module being disposed in the front panel; and
a second phase change material integrated into the front panel and configured to absorb heat produced by the camera module.

Assignees

• Futurewei Technologies Inc

Inventors

• Han Qian

Classifications

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H01L23/4275

  Electricity · mapped topic

• H01L23/427

  Electricity · mapped topic

• G03B17/55

  with provision for heating or cooling, e.g. in aircraft · CPC title