Internal frame structure with heat insulation effect and electronic apparatus with the internal frame structure

Patent metadata

Field	Value
Publication number	US-10019046-B2
Application number	US-201514828499-A
Country	US
Kind code	B2
Filing date	Aug 17, 2015
Priority date	Aug 17, 2015
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

An internal frame structure with heat insulation effect and an electronic apparatus with the internal frame structure. The internal frame includes a main body and a frame unit. A heat insulation layer is formed between the main body and the frame unit and positioned on at least two opposite sides of the main body. The heat insulation layer has a first side connected with the main body and a second side connected with the frame unit. The heat insulation layer serves to insulate the heat of the main body from being transferred to the frame unit.

First claim

What is claimed is:

1. An internal frame structure with heat insulation effect, comprising:
a main body provided with multiple mounting structures to associate with one or more internal electronic components and configured as a flat-plate heat pipe or a heat spreader or a vapor chamber and having an internal closed chamber with a capillary structure and a working fluid disposed in the closed chamber wherein heat generated by the one or more internal electronic components is spread over the main body by a vapor-liquid circulation of the working fluid taking place in the internal closed chamber;
a frame unit exposed to an external environment as a holding section and located around a peripheral edge of the main body and extending perpendicularly to the main body; and
a heat insulation layer sandwiched between the main body and the frame unit and positioned on at least two opposite outer sides of the peripheral edge of the main body to insulate the heat of the internal closed chamber of the main body from being transferred to the frame unit, the heat insulation layer having a first side connected with and completely covering corresponding peripheral faces of the main body and a second side connected with and only partially covering corresponding interior peripheral faces of the frame unit.

2. The internal frame structure with heat insulation effect of claim 1 , wherein the first and second sides of the heat insulation layer define therebetween a thickness.

3. An electronic apparatus comprising:
a display module having a front face;
a front case connected with the display module and formed with a window, the front face of the display module showing through the window;
an internal frame connected with the front case, the internal frame including:
a main body provided with multiple mounting structures to associate with one or more internal electronic components and configured as a flat-plate heat pipe or a heat spreader or a vapor chamber and having an internal closed chamber with a capillary structure and a working fluid disposed in the closed chamber wherein heat generated by the one or more internal electronic components is spread over the main body by a vapor-liquid circulation of the working fluid taking place in the internal closed chamber;
a frame unit exposed to an external environment as a holding section and located around a peripheral edge of the main body and extending perpendicularly to the main body; and

a heat insulation layer sandwiched between the main body and the frame unit and positioned on at least two opposite outer sides of the peripheral edge of the main body to insulate the heat of the internal closed chamber of the main body from being transferred to the frame unit, the heat insulation layer having a first side connected with and completely covering corresponding peripheral faces of the main body and a second side connected with and only partially covering corresponding interior peripheral faces of the frame unit.

4. The electronic apparatus as claimed in claim 3 , wherein the internal frame is connected with a back case or formed with a back case.

5. The electronic apparatus as claimed in claim 3 , wherein the display module is a touch display module.

6. The electronic apparatus of claim 3 , wherein the first and second sides of the heat insulation layer define therebetween a thickness.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Shen Ching-Hang

Classifications

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1643

  the display being associated to a digitizer, e.g. laptops that can be used as penpads (details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615) · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title