Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10692739-B2
Application number	US-201815907522-A
Country	US
Kind code	B2
Filing date	Feb 28, 2018
Priority date	Mar 2, 2017
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A substrate processing apparatus according to an exemplary embodiment to the present disclosure includes: a main body which has therein a processing space capable of accommodating the substrate; a holding unit which holds the substrate in the main body; a supply unit which is provided at a side of the substrate held by the holding unit and supplies the processing fluid into the processing space; a discharge unit which discharges the processing fluid from an inside of the processing space; and a flow path limiting unit which limits a lower end of a flow path at an upstream side which is formed while the processing fluid flows from the supply unit to the discharge unit. Further, an upper end of the flow path limiting unit is disposed at a position higher than the upper surface of the substrate held by the holding unit.

First claim

What is claimed is:

1. A substrate processing apparatus that performs a drying processing of drying a substrate, the substrate processing apparatus comprising:
a main body having therein a processing space capable of accommodating the substrate having an upper surface wet with a liquid, wherein the substrate is dried by bringing the substrate into contact with a processing fluid in a supercritical state;
a holder configured to hold the substrate within the main body;
a supply provided at a side of the substrate held by the holder and configured to supply the processing fluid into the processing space;
an exhaust configured to discharge the processing fluid from an inside of the processing space; and
a flow path limiter configured to limit an upstream side lower end of a flow path which is formed while the processing fluid flows from the supply to the exhaust,
wherein the flow path limiter has an upper end which is disposed at a position higher than the upper surface of the substrate held by the holder.

2. The substrate processing apparatus of claim 1 , wherein the upper end of the flow path limiter is disposed at a position lower than an upper end of the liquid applied onto the substrate.

3. The substrate processing apparatus of claim 1 , wherein the flow path limiter is a rectifying plate disposed between the supply and the substrate held by the holder, the rectifying plate having an upper end disposed at a position higher than the upper surface of the substrate.

4. The substrate processing apparatus of claim 3 , wherein the rectifying plate is provided on the holder.

5. The substrate processing apparatus of claim 3 , further comprising a separate rectifying plate provided at a downstream side of the flow path.

6. The substrate processing apparatus of claim 1 , wherein the flow path limiter is a lower portion of a supply port in the supply.

7. A substrate processing apparatus that performs a drying processing of drying a substrate, the substrate processing apparatus comprising:
a main body having therein a processing space capable of accommodating the substrate having an upper surface wet with a liquid, wherein the substrate is dried by bringing the substrate into contact with a processing fluid in a supercritical state;
a holder configured to hold the substrate within the main body;
a supply having a supply port provided at a side of the substrate held by the holder and configured to supply the processing fluid into the processing space; and
an exhaust configured to discharge the processing fluid from an inside of the processing space,
wherein a lower portion of the supply port is a flow path limiter configured to limit an upstream side lower end of a flow path which is formed while the processing fluid flows from the supply to the exhaust, and
wherein the processing fluid ejected from the supply is directed toward a side above the substrate held by the holder while the processing fluid flows from the supply to the exhaust.

8. The substrate processing apparatus of claim 7 , wherein a direction of the processing fluid ejected from the supply port is inclined upward.

Assignees

• Tokyo Electron Ltd

Inventors

• Kawabuchi Yosuke
• Goshi Gentaro
• Egashira Keisuke
• Ohno Hiroki
• Marumoto Hiroshi
• Masuzumi Takuro
• Tsukano Kento
• Kitayama Shotaro

Classifications

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/80

  Cleaning only by supercritical fluids · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• F26B21/40

  using gases other than air · CPC title