Embedded circuit board and method of making same

Patent metadata

Field	Value
Publication number	US-10667402-B2
Application number	US-201816145240-A
Country	US
Kind code	B2
Filing date	Sep 28, 2018
Priority date	Jul 27, 2018
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.

First claim

What is claimed is:

1. A method of making an embedded circuit board, the method comprising:
providing a circuit board comprising a flexible base layer, a first conductive circuit layer, and a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer formed on corresponding opposite surfaces of the flex base layer;
forming a photosensitive material layer onto an outer surface of the first conductive circuit layer;
selectively removing portions of the photosensitive material layer to form a mounting slot;
placing a component within the mounting slot to be mounted on and electrically connected to the first conductive circuit layer;
filling a glue in the mounting slot and the first conductive circuit layer to fix the component, wherein a thickness of the glue in a direction perpendicular to the flexible base layer is same as sum of thicknesses of the first conductive circuit layer and the photosensitive material layer, an outer surface of the glue away from the flexible base layer is level with an outer surface of the photosensitive material layer away from the flexible base layer;
forming a first copper plate onto an outer surface of the second conductive circuit layer and forming a second copper plate onto the photosensitive material layer, wherein each of the first copper plate and the second copper plate is adhered corresponding to the outer surface by an adhesive layer, and each of the first copper plate and the second copper plate comprises a flexible insulating film and a third copper layer; and
drilling, electroplating, and circuit configuration processing the circuit board to electrically interconnect the component, the circuit board, and two third conductive circuit layers together, wherein each of the two third conductive circuit layers formed from a corresponding one of the third copper layer of the first copper plate and the second copper plate.

2. The method of claim 1 , wherein a material of the base layer is selected from one of polyimide, liquid crystal polymer, polyethylene terephthalate, polyethylene naphthalate, and any combination thereof.

3. The method of claim 1 , wherein portions of the photosensitive material layer are selectively removed by exposing the portions of the photosensitive material layer to form the mounting slot, and then the photosensitive material layer is cured by UV solidifying and baking processes.

4. The method of claim 1 , wherein a width of the mounting slot is greater than a width of the component to be received within the mounting slot, and a depth of the mounting slot is greater than or equal to a thickness of the component to be received within the mounting slot.

Assignees

• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Avary Holding Shenzhen Co Ltd

Inventors

• Li yan-lu
• Wang jun-hua

Classifications

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/186 Primary

  manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title

• H05K3/241

  characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title