Heat dissipation structure, method for making the same, and electronic device having the same

Patent metadata

Field	Value
Publication number	US-10658265-B2
Application number	US-201715615065-A
Country	US
Kind code	B2
Filing date	Jun 6, 2017
Priority date	Sep 18, 2016
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

First claim

What is claimed is:

1. A heat dissipation structure comprising:
a flexible substrate comprising a first surface and a second surface facing away from the first surface;
a graphite sheet;
a cover plate;
and a heat insulating material;
wherein the flexible substrate is disposed on the graphite sheet and the second surface of the flexible substrate faces the graphite sheet, at least one containing cavity is formed between the flexible substrate and the graphite sheet, the heat insulating material is filled in the at least one containing cavity; the cover plate is disposed on the first surface of the flexible substrate, at least one groove is formed in the flexible substrate extending from the first surface of the flexible substrate toward the second surface of the flexible substrate, the at least one groove is sealed by the cover plate to form sealed cavity, a phase changing material is filled in the sealed cavity.

2. The heat dissipation structure of the claim 1 , wherein the groove further comprises a bottom surface and a side wall surrounding the bottom surface, the side wall, the bottom surface and the cover plate cooperate to form the sealed cavity, a plurality of microgrooves are formed in the bottom surface of the groove, areas of the microgrooves on the bottom surface decrease along a direction from a position at the bottom surface near the containing cavity to other positions at the bottom surface away from the containing cavity.

3. The heat dissipation structure of the claim 1 , wherein at least one lower recess is formed in the graphite sheet extending from a third surface of the graphite sheet facing the flexible substrate toward a surface of the graphite sheet facing away from the flexible substrate, the at least one lower recess is sealed by the flexible substrate to form the containing cavity.

4. The heat dissipation structure of the claim 1 , wherein at least one upper recess is formed in the second surface of the flexible substrate extending from the second surface of the flexible substrate toward the first surface of the flexible substrate, the at least one upper recess is sealed by the graphite sheet to form the containing cavity.

5. The heat dissipation structure of the claim 1 , wherein at least one upper recess is formed in the second surface of the flexible substrate extending from the second surface of the flexible substrate toward the first surface of the flexible substrate, at least one lower recess is formed in the surface of the graphite sheet extending from a third surface of the graphite sheet facing the flexible substrate toward a surface of the graphite sheet facing away from the flexible substrate, the at least one upper recess faces the at least one lower recess, and together form the containing cavity.

6. The heat dissipation structure of the claim 1 , wherein the heat insulating material is selected from a group consisting of air, polyimide resin, polyester resin, asbestos, and polypropylene resin.

Assignees

• Fukui Prec Component Shenzhen
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Avary Holding Shenzhen Co Ltd

Inventors

• Shen Fu-Yun
• Lei Cong
• Ho Ming-Jaan
• Hsu Hsiao-Ting

Classifications

• H01B17/54

  having heating or cooling devices · CPC title

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H01B7/428

  Heat conduction · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H01L23/4275

  Electricity · mapped topic